tag: 3D-IC

Reflections On 2015
By Brian Bailey - 22 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with SemiEngineering. We like to hold people's feet to the fire, but while the Pants-On-Fire meter may be applicable to politicians, we like to thin... » read more

Placing Bets On Future Technology
By Ed Sperling - 16 Nov, 2015 - Comments: 0

Marie Semeria, CEO of Leti, sat down with Semiconductor Engineering to talk about where the French research and technology organization is placing its future technology bets and what's behind those decisions. What follows are excerpts of that discussion. SE: It's becoming more difficult and expensive to shrink features, so where do we go next? Semeria: We see several areas that we believe... » read more

Tech Talk: 14nm And Stacked Die
By Ed Sperling - 11 Nov, 2015 - Comments: 0

Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything. [youtube vid=ukTRuedB7ZU] » read more

More Choices, Less Certainty
By Ed Sperling - 04 Nov, 2015 - Comments: 3

The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect
By Norman Chang - 15 Oct, 2015 - Comments: 0

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power techniques are widely used, while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected d... » read more

Security In 2.5D
By Ed Sperling - 12 Oct, 2015 - Comments: 2

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no. Put in perspective, all chips are vulnerable to [getkc id="253" kc_name="side channel attacks"], hacking of memory—a risk that increases... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Is HW Or SW Running the Show?
By Brian Bailey - 24 Sep, 2015 - Comments: 1

In the past, hardware was designed and then passed over to the software team for them to add their contribution to the product. This worked when the amount of software content was small and the practice did not significantly contribute to product delays. Over time, the software content grew and today it is generally accepted that software accounts for more product expense than hardware, takes l... » read more

SEMICON Taiwan’s Packaging Punch
By SEMI - 17 Sep, 2015 - Comments: 0

SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

New Options For Power
By Ed Sperling - 10 Sep, 2015 - Comments: 0

Chipmakers have been talking for years about the next big breakthrough in battery technology, low-power architectures and energy harvesting. So far, none of them has made their job any easier. Batteries empty out too quickly, and the technology for improving the amount of energy that can be stored don't improve fast enough—or safely enough when they do show big improvements—to make a big... » read more

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