tag: HBM

AI Memory: Enabling The Next Era Of High-Performance Computing
By Tadashi Oda - 11 Nov, 2025 - Comments: 0

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in high-bandwidth memory (HBM). However, as AI models grow in complexity—from large language models (LLMs) to real-time inference applications—the need for faster, higher-bandwidth, and energy-effici... » read more

HBM Leads The Way To Defect-Free Bumps
By Laura Peters - 11 Nov, 2025 - Comments: 0

High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and foundries must simultaneously handle multi-layer chip stacking, die warpage, and shorter product lifecycles that are shrinking from two years down to just one. But perhaps the most formidable c... » read more

China GenAI: Who Will Fill The Vacuum?
By Geoff Tate - 10 Nov, 2025 - Comments: 1

China and the U.S.A are locked in a titanic battle over tariffs. The U.S. makes the world’s best AI Accelerators: Nvidia, AMD, Google, AWS …among others. But the U.S. worries China could deploy these for military purposes, so it imposed strict export controls that resulted in China getting the second-best AI accelerators. These export controls have been further tightened as part of tarif... » read more

Algorithm–HW Co-Design Framework for Accelerating Attention in Large-Context Scenarios (Cornell)
By Technical Paper Link - 07 Nov, 2025 - Comments: 0

A new technical paper titled "LongSight: Compute-Enabled Memory to Accelerate Large-Context LLMs via Sparse Attention" was published by researchers at Cornell University. Abstract "Large input context windows in transformer-based LLMs help minimize hallucinations and improve output accuracy and personalization. However, as the context window grows, the attention phase increasingly dominates... » read more

LPDDR6: Not Just For Mobile Anymore
By Ed Sperling - 03 Nov, 2025 - Comments: 0

LPDDR memory has been almost synonymous with mobile devices, but starting with the new LPDDR6 specification released in July 2025 by JEDEC, it will begin showing up inside of data centers, as well, early next year. The key factors in various flavors of DRAM are bandwidth, capacity, and cost. HBM is the fastest, but it's also expensive, and it requires a 2.5D or 3.5D packaging approach. GDDR is ... » read more

Critical Factors For Storing Data In DRAM
By Ed Sperling - 27 Oct, 2025 - Comments: 0

DRAM is becoming more complicated to develop, and more difficult to manage inside AI data centers. In the past, latency, bandwidth, and capacity were the primary considerations. But as the amount of data that needs to be processed, moved, and stored continues to rise, a whole new set of factors is emerging. Steven Woo, fellow and distinguished inventor at Rambus, talks about latency under load,... » read more

3D Stacked HBM and Accelerators for LLMs: Heat Management and PDN (Georgia Tech, SK Hynix)
By Technical Paper Link - 17 Oct, 2025 - Comments: 0

A new technical paper titled "3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency" was published by a researcher from Georgia Institute of Technology and SK Hynix. Abstract "Advanced packaging is becoming essential for designing hardware accelerators for large language models (LLMs). Different architectures such as 2.5D integration of... » read more

Heterogeneous System With Specialized HW For Disaggregated LLM Inference (Princeton Univ., Univ. of Washington)
By Technical Paper Link - 14 Oct, 2025 - Comments: 0

A new technical paper titled "SPAD: Specialized Prefill and Decode Hardware for Disaggregated LLM Inference" was published by researchers at Princeton University and University of Washington. Abstract "Large Language Models (LLMs) have gained popularity in recent years, driving up the demand for inference. LLM inference is composed of two phases with distinct characteristics: a compute-boun... » read more

Interconnect Innovations In High Bandwidth Memory: Part 2
By Damon Tsai - 14 Oct, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid bonding. Both technologies are evolving to address the stringent requirements of next generation HBM in pursuit of increased I/O density supporting high... » read more

On-Package Memory With UCIe To Improve Bandwidth Density And Power Efficiency (AMD, Intel Corp.)
By Technical Paper Link - 10 Oct, 2025 - Comments: 0

A new technical paper titled "On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach" was published by researchers at Intel Corporation and AMD. Abstract "Emerging computing applications such as Artificial Intelligence (AI) are facing a memory wall with existing on-package memory solutions that are unable to meet ... » read more

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