tag: memory

The Week In Review: Design
By Jesse Allen - 31 Mar, 2017 - Comments: 0

M&A Siemens closed the acquisition of Mentor Graphics, making Mentor now part of Siemens' product lifecycle management (PLM) software business. The $4.5 billion deal, announced last November, brings Siemens into the IC design tool and embedded software markets and expands Siemens' multi-physics and electronic simulation capabilities in the growing digital twin space, which ties together ... » read more

HBM Upstages DDR In Bandwidth, Power
By Ann Mutschler - 30 Mar, 2017 - Comments: 1

For graphics, networking, and high performance computing, the latest iteration of high-bandwidth memory (HBM) continues to rise up as a viable contender against conventional DDR, GDDR designs, and other advanced memory architectures such as the Hybrid Memory Cube. [getkc id="276" kc_name="HBM"] enables lower power consumption per I/O and higher bandwidth memory access with a more condensed f... » read more

Optimal Memory Strategies: Where HBM2 Fits
By eSilicon - 23 Mar, 2017 - Comments: 0

How are you going to build your next big product? Whether it’s in the networking, wireless, mobile or computing market, you are now increasing the functionality of your product. It needs to be able to do many tasks – fast, at low power, and pack as much functionality into the tiniest area for cost effectiveness. What does this mean for the embedded memory content? It is growing rapidly. ... » read more

China: Fab Boom or Bust?
By Mark LaPedus - 16 Mar, 2017 - Comments: 2

China’s semiconductor industry continues to expand at a frenetic pace. At present there are nearly two dozen new fab projects in China. Whether all these fab projects get off the ground is not entirely clear because the dynamics in China remain fluid. What is clear is the motivation behind this building frenzy—China is trying to reduce its huge trade imbalance in ICs. The country continu... » read more

HBM2: It’s All About The PHY
By Bill Fuller - 09 Mar, 2017 - Comments: 0

HBM DRAM is currently used in graphics, high-performance computing (HPC), server, networking and client applications. HBM, says JEDEC HBM Task Group Chairman Barry Wagner, provides a “compelling solution” to reduce the IO power and memory footprint for the most demanding applications. Recent examples of second-generation HBM deployment include NVIDIA’s Quadro GP100 GPU which is paired wit... » read more

Semiconductor CapEx To Increase 4.3% In 2017
By Adrienne Downey - 20 Feb, 2017 - Comments: 0

Semiconductor capital expenditures are an important bellwether for the industry. Based on preliminary findings, Semico Research predicts 2017’s total will increase 4.3% to $69.7 billion, a record high, and a slightly larger increase than in 2016. Semico tracks more than 80 companies for CapEx and R&D spending, although many of those companies have merged, have been acquired, or gone ba... » read more

Get Ready For Nanotube RAM
By Mark LaPedus - 20 Feb, 2017 - Comments: 6

The memory market is going in several different directions at once. On one front, the traditional memory types, such DRAM and flash, remain the workhorse technologies in systems despite undergoing some changes in the business. Then, several vendors are readying the next-generation memory types in the market. As part of an ongoing series, Semiconductor Engineering will explore where the new a... » read more

What Are FeFETs?
By Mark LaPedus - 16 Feb, 2017 - Comments: 1

The memory market is going in several different directions at once. On one front, the traditional memory types, such DRAM and flash, remain the workhorse technologies in systems despite undergoing some changes in the business. Then, several vendors are readying the next-generation memory types in the market. As part of an ongoing series, Semiconductor Engineering will explore where the new a... » read more

New Memories And Architectures Ahead
By Brian Bailey - 13 Feb, 2017 - Comments: 4

Memory dominates many SoCs, and it is rare to hear that a design contains too much memory. However, memories consume a significant percentage of system power, and while this may not be a critical problem for many systems, it is a bigger issue for Internet of Things ([getkc id="76" kc_name="IoT"]) edge devices where total energy consumption is very important. Memory demands are changing in al... » read more

The Challenges Of Designing An HBM2 PHY
By Frank Ferro - 09 Feb, 2017 - Comments: 1

Originally targeted at the graphics industry, HBM continues to gain momentum in the server and networking markets as system designers work to move higher bandwidth closer to the CPU. Expanding DRAM capacity – which boosts overall system performance – allows data centers to maximize local DRAM storage for wide throughput. HBM DRAM architecture effectively increases system memory bandwidth... » read more

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