Potential Route To Photonic FPCA Using NV Low-Loss Phase Change Material (Oxford)


A new technical paper, "Nonvolatile photonic field-programmable coupler array," was published by researchers at University of Oxford. Abstract "Programmable photonic networks carry out universal unitary functions by independently operating on the amplitude and phase of guided light. Exploiting the reconfigurability and spatiospectral degrees of freedom of these systems, the majority of stat... » read more

Digital Memristor-Based PIM From A Device And Reliability View (Northwestern, Technion)


A new technical paper titled "A Comparative Study of Digital Memristor-Based Processing-In-Memory from a Device and Reliability Perspective" was published by researchers at Northwestern University and  Technion – Israel Institute of Technology. Abstract "As data-intensive applications increasingly strain conventional computing systems, processing-in-memory (PIM) has emerged as a promis... » read more

Emerging Synaptic Memory Technologies For Neuromorphic CIM Platforms (Tampere Univ.)


A new technical paper titled "Toward Capacitive In-Memory-Computing: A Device to Systems Level Perspective on the Future of Artificial Intelligence Hardware" was published by researchers at Tampere University. Abstract: "The quest for energy-efficient, scalable neuromorphic computing has elevated compute-in-memory (CIM) architectures to the forefront of hardware innovation. While memristive... » read more

Emerging NVM: Review Of Emerging Memory Materials And Device Architectures


A new technical paper titled "Emerging Nonvolatile Memory Technologies in the Future of Microelectronics" was published by researchers at Texas A&M University, University of Massachusetts and USC. Abstract "Memory technologies are central to modern computing systems, performing essential functions that range from primary data storage to advanced tasks, such as in-memory computing for ... » read more

PCM-Based IMC Technology: Overview Of Materials, Device Physics, Design and Fabrication (IBM Research-Europe)


A new technical paper titled "Phase-Change Memory for In-Memory Computing" was published by researchers at IBM Research-Europe. "We review the current state of phase-change materials, PCM device physics, and the design and fabrication of PCM-based IMC chips. We also provide an overview of the application landscape and offer insights into future developments," states the paper. Find the te... » read more

Design Space For The Device-Circuit Codesign Of NVM-Based CIM Accelerators (TSMC)


A new technical paper titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by TSMC researchers. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devices. Nonvolatile memory (NVM) devices offer one s... » read more

Research Bits: Nov. 25


3D-printed ESD protection Researchers from Lawrence Livermore National Laboratory developed a printable elastomeric silicone foam for electronics packaging that provides both mechanical and electrostatic discharge (ESD) protection. The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled rheological properties such as elast... » read more

Directly Writing and Rewriting Photonic Chips on Low-Loss Phase-Change Thin Films


A technical paper titled “Freeform direct-write and rewritable photonic integrated circuits in phase-change thin films” was published by researchers at University of Washington, University of Maryland, and Tianjin University. Abstract: "Photonic integrated circuits (PICs) with rapid prototyping and reprogramming capabilities promise revolutionary impacts on a plethora of photonic technolo... » read more

A New Phase-Change Memory For Processing Large Amounts Of Data 


A technical paper titled “Novel nanocomposite-superlattices for low energy and high stability nanoscale phase-change memory” was published by researchers at Stanford University, TSMC, NIST, University of Maryland, Theiss Research and Tianjin University. Abstract: "Data-centric applications are pushing the limits of energy-efficiency in today’s computing systems, including those based on... » read more

3D Integration Supports CIM Versatility And Accuracy


Compute-in-memory (CIM) is gaining attention due to its efficiency in limiting the movement of massive volumes of data, but it's not perfect. CIM modules can help reduce the cost of computation for AI workloads, and they can learn from the highly efficient approaches taken by biological brains. When it comes to versatility, scalability, and accuracy, however, significant tradeoffs are requir... » read more

← Older posts