Liquid Cooling Gains Traction In Data Centers


All electronics generate heat, and that heat must be removed to ensure those electronics don’t overheat. Moving air has been the predominant approach for decades, with liquid cooling limited to particularly intense computing workloads, largely in the supercomputing domain. With the rise in AI, data-center power density has grown to the point where liquid cooling is now seeing a larger buil... » read more

Integrating Optics And Engineering: How Simulation Transforms Medical Device Design


The integration of optical systems in medical devices is a rapidly growing area of focus and investment within the medical technology sector. From surgical lasers and diagnostic imaging tools to microscopes applied in research, advanced optics have enormous potential to drive better patient outcomes. However, designing advanced optical systems for medical devices poses numerous complex... » read more

Blog Review: Jan. 14


Arm's Paul Black demonstrates how lightweight LLVM sanitizers help detect undefined behavior, improve code quality, and expose hidden bugs in embedded C and C++ projects, with a focus on two sanitizers that can catch issues such as unsigned signed shift overflows, array overflows, and stack corruption. Imagination's Alex Pim provides an overview of LLM inference acceleration for mobile and e... » read more

Robust Dynamic Voltage Droop Mitigation And Power Management


Power management is one of the keys for developing successful semiconductors products. There are virtually no applications for which power consumption is not a concern. Many creative solutions have been developed to reduce and manage power. Making these schemes work robustly in real-world conditions can be a challenge. This post considers widely used methods—voltage droop/glitch detection and... » read more

Secure Data Sharing Becoming Critical For Chip Manufacturing


Semiconductor companies increasingly need to share data to solve problems faster, boost yield, and trace the root cause of failed devices. But to make that work, companies need assurances that their data will be secure, free from data leaks that could result in the loss of valuable IP. Data sharing is becoming critical at leading device nodes, where process variability is starting to consume... » read more

Chip Industry Week in Review


SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Securing Terabit Ethernet Networks With 1.6T MACsec Security Modules


By Dana Neustadter and Vincent van der Leest In the realm of high-performance computing (HPC) and data centers, Ethernet is one of the interfaces of choice due to its scalability, reliability, and broad industry support. Ethernet's ability to efficiently handle large volumes of data makes it ideal for HPC environments that require high-speed data transmission and seamless integration with ex... » read more

Is End-To-End Security Possible?


Looming financial penalties for data breaches are forcing chipmakers to confront end-to-end security, an increasingly complex and daunting problem because no single company controls all the pieces anymore. This is especially apparent in multi-die assemblies, in use today in data centers, and under consideration in automotive and other applications. Multiple chiplets can push performance well... » read more

Automotive Outlook: 2026


The automotive industry stands at a crossroads entering 2026, facing a complex interplay of global tariffs, evolving electric vehicle (EV) dynamics, and the infusion of AI into just about everything. As manufacturers and suppliers navigate recent financing shifts and regulatory changes, they also must address consumer concerns over EV affordability and range, OEM concerns over when to develo... » read more

Security Threats Converge On IoT, Industrial ICs, Physical AI


Devices in a broad range of edge AI applications are increasingly at risk of hacking or tampering, with the stakes varying greatly depending on how much the device can impact and interact with human life. Design methods and protection techniques must now be included up front in the design cycle for optimal protection of consumers and companies as the quantum threat looms. In today’s factor... » read more

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