Week In Review: Design, Low Power


VESA published the DisplayPort 2.0 standard, which allows for a max payload of 77.37 Gbps, a 3X increase in data bandwidth performance compared to DisplayPort 1.4a. The latest release also includes capabilities to address beyond 8K resolutions, higher refresh rates and HDR support at higher resolutions, multiple display configurations, and support for 4K-and-beyond VR resolutions. It is backwar... » read more

Week in Review: IoT, Security, Auto


Products/Services Visa agreed to acquire the token and electronic ticketing business of Rambus for $75 million in cash. The business involved is part of the Smart Card Software subsidiary of Rambus. It includes the former Bell ID mobile-payment businesses and the Ecebs smart-ticketing systems for transit providers. Meanwhile, Rambus expanded its CryptoManager Root of Trust product line. “Sec... » read more

Automation And Correct By Construction Will Empower 3D-IC Adoption


When research on 3D ICs was in full swing around 2009, I had been researching on how through-silicon-via (TSV) was related to thermal in a semiconductor chip-making company, and it seemed logical that 3D ICs would become mainstream. However, during the past 10 years, use of 3D stacked die has been applied to only a few applications, such as memory or image sensors, and the 2.5D solution using i... » read more

Verification In The Cloud


Christen Decoin, senior director of business development at Synopsys, talks with Semiconductor Engineering about what’s changed for EDA in the cloud, why it has taken so long, and what new benefits the cloud will offer. Rules have changed at foundries, and the customer base for designs is evolving. » read more

Top Considerations For Evaluating The Tech In Tech M&A


M&A is high stakes. With thousands of transactions and billions of dollars spent on technology mergers and acquisitions every year, acquirers must protect their investments by conducting due diligence. This white paper discusses: Risks you may encounter in an M&A transaction involving software; How to evaluate these risks using a multifaceted evaluation model; What to look... » read more

Will Open-Source EDA Work?


Open-source EDA is back on the semiconductor industry's agenda, spurred by growing interest in open-source hardware. But whether the industry embraces the idea with enough enthusiasm to make it successful is not clear yet. One of the key sponsors of this effort is the U.S. Defense Advanced Research Projects Agency (DARPA), which is spearheading a number of programs to lower the cost of chip ... » read more

Blog Review: June 26


Arm's Krish Nathella and Dam Sunwoo dig into research to make a practical implementation of a temporal data prefetcher that overcomes the huge on- and off-chip storage and traffic overheads usually associated with them. Cadence's Paul McLellan notes that while concerns about uncover bias in computer vision algorithms usually focus on people, a team at Facebook found that object recognition t... » read more

Wrestling With High-Speed SerDes


SerDes has emerged as the primary solution in chips where there is a need for fast data movement and limited I/O, but this technology is becoming significantly more challenging to work with as speeds continue to rise to offset the massive increase in data. A Serializer/Deserializer is used to convert parallel data into serial data, allowing designers to speed up data communication without h... » read more

Blog Review: June 19


Mentor's Rebecca Lord digs into signal integrity complications and why today's high frequency signals make it important to understand the physics of transmission lines. Cadence's Meera Collier points to the need to recognize diversity and nuance when compiling AI training datasets and avoid the oversimplification that can lead to bias. Synopsys' Deepak Nagaria checks out the new features ... » read more

Week in Review: IoT, Security, Auto


Products/Services Mentor, a Siemens Business, announced the release of the final phase of the Valor software New Product Introduction design-for-manufacturing technology, automating printed circuit board design reviews. The company has integrated DFM technology into the Xpedition software layout application. Arteris IP reports that Toshiba has taped out its next-generation advanced driv... » read more

← Older posts Newer posts →