tag: agentic AI

Agentic AI In Chip Manufacturing
By Ed Sperling - 28 Jan, 2026 - Comments: 1

Agentic AI — breaking AI into individual agents that can work together and collaboratively — will be the real game changer for AI in chip manufacturing. By taking humans out of the loop, these agents can be programmed using natural language to automatically solve problems and improve efficiency. Jon Herlocker, vice president and general manager of software analytics at Cohu, talks  about w... » read more

Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms
By PDF Solutions - 13 Jan, 2026 - Comments: 0

Demand for advanced computing is robust, driven by AI, cloud technologies, and widespread electrification of the economy. As Moore’s Law slows, the industry is pivoting toward innovative approaches—exploring 3D architectures, chiplets, and sophisticated hybrid packages. Concurrently, the semiconductor landscape is becoming increasingly global, with advanced devices now relying on integratin... » read more

Is End-To-End Security Possible?
By Ed Sperling - 08 Jan, 2026 - Comments: 0

Looming financial penalties for data breaches are forcing chipmakers to confront end-to-end security, an increasingly complex and daunting problem because no single company controls all the pieces anymore. This is especially apparent in multi-die assemblies, in use today in data centers, and under consideration in automotive and other applications. Multiple chiplets can push performance well... » read more

Chip Industry’s Top Videos 2025
By The SE Staff - 30 Dec, 2025 - Comments: 0

Rising complexity, new architectures, and AI's permeation of nearly everything left engineers struggling to keep up in 2025, as evidenced by this year's viewership numbers. Among the hottest topics were verification, agentic AI, DRAM/HBM, optimization of data movement, chiplets, and heterogeneous integration, but there was steady traffic growth across all sectors. Top 10 most-watched videos ... » read more

Autonomous ASIC Root Cause Analysis
By Mehir Arora - 23 Dec, 2025 - Comments: 0

By Mehir Arora and Zackary Glazewski Over 50% of frontend ASIC hardware engineering time is spent on debugging and root cause analysis, spent churning through millions of lines of code and terabytes of waveform data. Despite this, there are no existing solutions for autonomous root cause analysis that use both code and waveform data. ChipAgents Root Cause Analysis (ChipAgents RCA) is the fir... » read more

The Growing Need For Collaboration Across The Semiconductor Industry
By PDF Solutions - 09 Dec, 2025 - Comments: 0

Abstract: AI-driven collaboration is becoming essential for the semiconductor industry to manage its increasingly complex global supply chain. This new model facilitates real-time data sharing and multi-party orchestration, moving beyond conventional, crisis-driven interactions. By leveraging a secure data infrastructure, automated orchestration, and AI agents, companies can automate busines... » read more

AI Plays Multiple Roles Within EDA
By Brian Bailey - 25 Nov, 2025 - Comments: 0

AI's infusion into our world may seem sudden and unexpected, but EDA has been quietly adopting it for more than a decade. What's changed is that it's now becoming more visible, thanks to increasingly powerful large language models (LLMs) and the need to apply them to increasingly challenging multi-physics problems. Two fundamental shifts underlie AI's increasing prominence. First, heat is be... » read more

AI-Driven Collaboration In Chip Manufacturing
By Ed Sperling - 24 Nov, 2025 - Comments: 0

3D chips and multi-die assemblies can offer significant improvements in performance and power, but the tradeoff is the increased amount of time and money it takes to generate working silicon. There are more process steps, more interactions between processes, and more data to manage throughout the manufacturing flow — so much, in fact, that it has now reached well beyond what even the best eng... » read more

Edge AI Safety: Agentic AI Architecture That Leverages 3D To Integrate A Dedicated Safety Layer (Princeton, HKUST, NC State Univ.)
By Technical Paper Link - 17 Nov, 2025 - Comments: 0

A new technical paper titled "3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence" was published by researchers at Princeton University, Hong Kong University of Science and Technology, and North Carolina State University. Abstract "AI systems have found a wide range of real-world applications in recent years. The adoption of edge artificial intelligence, ... » read more

The Future Of Digital Engineering In The Age Of AI
By Laura Carter - 13 Nov, 2025 - Comments: 0

Digital engineering gives innovators creative agency to test the limits of their ideas in a virtual environment. It is in this convergence of digital technologies, data-driven models, and advanced simulations where new designs are born at unprecedented levels of speed and accuracy. Adding artificial intelligence (AI) into the mix further accelerates innovation by unlocking opportunities to a... » read more

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