Manufacturing Bits: June 18


Making microvias in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, Georgia Institute of Technology, Tokyo Ohka Kogyo (TOK) and Panasonic presented a paper on a technology that enables ultra-small microvias for advanced IC packages. Researchers demonstrated a picosecond UV laser technology as well as materials, which enabled 2μm to 7μm vias... » read more

Inside Panel-Level Fan-Out Technology


Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

Manufacturing Bits: Oct. 20


Singapore opens R&D center The Agency for Science, Technology and Research (A*STAR) has officially opened its new R&D center in Singapore. The center, dubbed Fusionopolis Two, is a $450 million facility, according to Singapore’s A*STAR. It will provide the industry with co-location opportunities for R&D. Anchored at Fusionopolis Two are the following A*STAR research institutes: th... » read more