tag: ANSYS

Advanced Packaging For Automotive Chips
By Ann Mutschler - 02 Dec, 2021 - Comments: 0

Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Blog Review: Dec. 1
By Jesse Allen - 01 Dec, 2021 - Comments: 0

Synopsys' Mike Gianfagna points to three events that created a fundamental shift in product development that has enabled rapid introduction of a wide range of new products. Siemens' Sagi Reuven considers some key challenges facing the supply chain and the impact on electronics manufacturers, from rising shipping costs to shortages of raw materials and transportation labor. Cadence's Frank... » read more

Missing Interposer Abstractions And Standards
By Brian Bailey - 29 Nov, 2021 - Comments: 0

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, it will be a technique that only large companies can deploy because they need to treat everything almost as if it were a single die. The construction of large systems uses techniques, such as ab... » read more

Blog Review: Nov. 24
By Jesse Allen - 24 Nov, 2021 - Comments: 0

Cadence's Paul McLellan introduces the theory and practice of datapath formal verification and explores two use cases of dot-product accumulate systolic design and hashing design. Siemens EDA's Rich Edelman shows that constructing an in-order UVM scoreboard doesn't have to be a difficult or complex task, and certainly simpler than replacing a laptop's keyboard. Synopsys' Gordon Cooper con... » read more

Advanced Packaging Shifts Design Focus To System Level
By Ann Mutschler - 23 Nov, 2021 - Comments: 0

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it's also straining some EDA tools and methodologies and creating gaps in areas where none existed. These changes are causing churn in unexpected areas. For some chip companies, this has resulted in a slowdown in hiring of ASIC designers and an uptick in new jo... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 19 Nov, 2021 - Comments: 0

3D-ICs Samsung Foundry released 3D-IC EDA flows approvals. 3D-ICs, which are the multi-dies stacked together and integrated into a package, are finding use in automotive, high-performance computing, and artificial intelligence systems. Samsung Foundry qualified Cadence’s 2D-to-3D native 3D partitioning flow for 3D-IC design that automates creating a memory-on-logic 3D stacking configuration,... » read more

Blog Review: Nov. 17
By Jesse Allen - 17 Nov, 2021 - Comments: 0

In a podcast, Arm's Geof Wheelwright and Hilary Tam chat about the importance of efforts to decarbonize compute and how low-power compute can help ensure that the benefits of technology outweigh the environmental cost. Synopsys' Graham Allan and Vikas Gautam consider what's driving demand for HBM3, what's different from the previous HBM2E specification, unique design considerations, and how ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 12 Nov, 2021 - Comments: 0

Infineon reported fourth quarter 2021 financial results with revenue of €3.0 billion (~$3.4 billion), up 21% compared to the same quarter last year. For the full year, revenue was €11.1 billion (~$12.7 billion), an increase of 29% from the previous year. "In light of the continued high demand for semiconductors needed for the energy-efficient, connected world, we expect the 2022 fiscal year... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 12 Nov, 2021 - Comments: 0

Automotive The U.S. Congress passed an infrastructure bill that includes mandates for the U.S. automobiles to install technology in new vehicles that will stop impaired drivers from driving a vehicle. Sec. 24220, the advanced impaired driving technology section of the bill says the Secretary of Transportation is responsible for coming up with standards after which the auto industry has at the ... » read more

Improving Power Efficiency In Ultra-Low Power Designs
By John Koon - 11 Nov, 2021 - Comments: 0

Faster data communications in phones and data centers grabs headlines, but many applications don't require the continuous, high-data-rate communications needed for video streaming or image processing. In fact, for many devices, designing for better performance results in wasted energy and sharply curtails the time between battery charges. That is especially true for machine-to-machine (M2M) ... » read more

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