From Data To Decisions: Exploring Enterprise Digital Thread Strategy And Simulation


By Sanjay Angadi and Matteo Nicolich It’s nice to think that “aha” moments come out of nowhere — that the next big thing is the result of unbridled genius (or plain dumb luck). But in reality, effective, sustainable product development rarely arises from a solitary flash of brilliance. Innovation requires information, context, collaboration, experimentation, and even failure. Usin... » read more

Often Overlooked, PHYs Are Essential To High-Speed Data Movement


Over the past couple of decades, the semiconductor industry has evolved from a supporting role for traditional verticals like mobile, automotive, and PCs to a foundational role in those markets, as well as in AI factories and hyperscale data centers. Underlying this transformation is the physical layer (PHY), which has emerged as a critical enabler for data transfer and communications. The P... » read more

EBook: Optimizing Analog Design With Multiphysics


As technologies like artificial intelligence (AI), 5G, electric vehicles, and high-speed computing continue to advance, analog and mixed-signal (AMS) technologies have become the unsung heroes of next-gen electronics. AMS chips are enabling smarter, faster, and more efficient systems, but traditional design approaches are struggling to keep pace. Interconnect parasitics, power integrity, photo... » read more

Blog Review: July 16


Synopsys' Bradley Geden and Manoz Palaparthi explain the difference between functional signoff and RTL signoff and why increased SoC complexity means that verification flows must now capture both the intent and the integrity of a design before it can move forward. Cadence's Frank Ferro finds that LPDDR isn't just for mobile devices anymore, with the new LPDDR6 standard bringing increased ban... » read more

AI In Chip Design: Tight Control Required


Executive Outlook: Semiconductor Engineering sat down with a panel of experts to talk about what's needed to effectively leverage AI, who benefits from it, and where software-defined hardware works best, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Ze... » read more

AI Pushes High-End Mobile From SoCs To Multi-Die


Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, more flexibility, and faster time to market than systems on chip. Monolithic SoCs likely will remain the technology of choice for low-end and midrange mobile devices because of their form factor, proven record, and lower cost. But multi-die assemblies provide more fle... » read more

6G Rollout Will Be A Patchwork At First


6G is expected to begin rolling out in 2030, but advances in 5G will inch cellular technology close enough that it will make the first 6G implementations seem more like just another upgrade. That's just the starting point, though. 6G technology gets much more interesting from there, connecting more devices at a significantly higher data rate, and enabling services that would be unattractive to ... » read more

Chip Industry Week in Review


[Editor's Note: Early edition due to the U.S. July 4th holiday.] The U.S. government lifted export restrictions that barred Synopsys, Siemens EDA, and Cadence from selling EDA tools to China. In a statement, Synopsys said it received a letter from the U.S. Commerce Department immediately rescinding those restrictions. Siemens issued a similar statement. Which tools or hardware accelerated t... » read more

Blog Review: July 2


Synopsys’ Shankar Krishnamoorthy chats with industry experts about how the combination of AI and software-defined systems is driving a re-evaluation of engineering workflows and why chip, software, and system development must evolve in unison. Siemens’ Jake Wiltgen considers the rapidly evolving and growing challenge of performing DFT verification as designs scale, with complex hierarchi... » read more

Novel Assembly Approaches For 3D Device Stacks


The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age. Not all of these issues are fully solved but the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that... » read more

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