Foundries Accelerate Auto Efforts


Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

Is 7nm The Last Major Node?


A growing number of design and manufacturing issues are prompting questions about what scaling will really look like beyond 10/7nm, how many companies will be involved, and which markets they will address. At the very least, node migrations will go horizontally before proceeding numerically. There are expected to be more significant improvements at 7nm than at any previous node, so rather th... » read more

Toward Smarter Manufacturing


Semiconductor manufacturing is becoming increasingly competitive as significant investments in capital equipment are required to meet consumer demand for higher performing devices with greater functionality. To boost their competitiveness, chip makers are adopting Industry 4.0 manufacturing techniques to achieve higher levels of operational excellence. In this blog, I explain Industry 4.0, prov... » read more

Blog Review: July 19


Synopsys' Prishkrit Abrol provides a detailed explanation of how the USB Type-C connector works. Mentor's Ricardo Anguiano examines how the RISC-V ecosystem is expanding and latest developments in the open source toolchain. Cadence's Gopi Krishnamurthy explains the lane margining requirements of the PCIe 4.0 specification. ARM's Chet Babla unravels some claims about Narrowband IoT, Cat... » read more

The Week In Review: Manufacturing


Market research SEMI has released its mid-year forecast at Semicon West. SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase by 19.8% to a total of $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000. In 2018, 7.7% growth is expected, resulting in an... » read more

Blog Review: July 5


Cadence's Paul McLellan checks out the current state of System-in-Package technology and how different products incorporate SiP. Synopsys' Robert Vamosi digs into the differences between two major recent ransomware outbreaks, WanaCry and Petya. A Mentor staff writer shares some highlights from this year's DAC. ARM's Rene Haas examines what consumers think about AI and the impact it wil... » read more

The Week In Review: Manufacturing


Chipmakers Toshiba and its fab partner, Western Digital, have jointly rolled out a 96-layer 3D NAND product amid a legal dispute. The companies have developed prototype samples of a 96-layer 3D NAND device. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, is scheduled for release in the second half of 2017 and mass production is targeted for 2018. Separately, ... » read more

Blog Review: June 28


Mentor's Craig Armenti notes the benefits, and challenges, of investing in modular design in the PCB domain. Cadence's Paul McLellan covers a DAC chat with CEO Lip-Bu Tan on the rise of advanced packaging and investments in AI and autonomous driving. Synopsys' Jim Hartnett examines some of the challenges and tradeoffs involved in building good security practices in hospital environments. ... » read more

The Week In Review: Manufacturing


Chipmakers The NAND market is in flux. Not long ago, troubled Toshiba put its memory unit on the block. Finally, the company has selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. Others attempted to bid on the business, including Western Digita... » read more

NAND Market Hits Speed Bump


Demand for NAND flash memory remains robust due to the onslaught of data in systems, but the overall NAND flash market is stuck in the middle of a challenging period beset by product shortages, supply chain issues and a difficult technology transition. Intel, Micron, Samsung, SK Hynix and the Toshiba/Western Digital duo continue to ship traditional planar NAND in the market, but this technol... » read more

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