tag: Arteris

AI Starting To Simplify Design Of Programmable Logic
By Liz Allan - 26 Feb, 2026 - Comments: 0

Key Takeaways AI/ML and agentic tools are getting better at helping design and compile FPGAs, but downstream programming is slower to benefit. FPGAs historically have been designed using Verilog or VHDL, but higher-level languages could push more intelligence into compilers. ML tools can also help with mixed-signal co-design by automatically tuning DSP algorithms based on analog simu... » read more

Can A Computer Science Student Be Taught To Design Hardware?
By Liz Allan - 17 Feb, 2026 - Comments: 2

Key Takeaways New approaches are being devised and tested to address the talent shortage. Leveraging AI in design tools will help engineers become more efficient, and potentially could reduce the time it takes to train engineering students. EDA companies are looking at whether it's possible to train computer science and software engineers to become hardware engineers. A vari... » read more

Chip Industry Week In Review
By The SE Staff - 13 Feb, 2026 - Comments: 0

Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Minimum Energy Per Query
By Brian Bailey - 12 Feb, 2026 - Comments: 1

Key Takeaways Extracting heat from a chip faster is a short-term fix to a bigger problem. The longer-term challenge is how to reduce the amount of energy used per query. Data movement, guardbanding, and software inefficiency are key targets for the future. Heat is a serious problem within AI chips, and it is limiting how much processing can be done. The solution is either to... » read more

Solving Real-World AI Bottlenecks
By André Bonnardot - 02 Feb, 2026 - Comments: 0

The race to build smarter and faster AI chips continues to surge. This is especially true in autonomous vehicles that interpret the world in milliseconds, edge accelerators that push trillions of operations per second, hyperscale data-center processors that drive massive workloads, and next-generation consumer devices that demand ever-higher intelligence. As modern system-on-chip (SoC) architec... » read more

Does Your RISC-V Core Meet The Standard?
By Brian Bailey - 29 Jan, 2026 - Comments: 0

Key Takeaways Architectural conformance and implementation verification are necessary but different for RISC-V designs, yet few verification engineers have experience on the conformance side. While RISC-V enables flexibility, there is a potential for ecosystem fragmentation. It is mathematically impossible to test every instruction combination, so engineers are moving beyond just "bl... » read more

AI’s Impact On Engineering Jobs May Be Different Than Expected
By Liz Allan - 29 Jan, 2026 - Comments: 0

Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil... » read more

Will It Blend: A Methodology for Verifying the Hardware/Software Interface in Complex SoCs
By Arteris - 28 Jan, 2026 - Comments: 0

Verification of modern System on Chip (SoC) designs involve many components. Hardware Description Languages (VHDL, System Verilog), Unified Power Format (UPF), Software Languages (C#/C++), Interconnect standards (IP-XACT, AMBA), and specialty purpose-built layers such as the Universal Verification Methodology (UVM) and System Verilog Assertions (SVA). This deck explores using Arteris SoC Integr... » read more

Chip Industry Week in Review
By The SE Staff - 16 Jan, 2026 - Comments: 0

Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S.  The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Challenges In Moving Data In Chips
By Ed Sperling - 14 Jan, 2026 - Comments: 0

The number of processes running simultaneously inside of chips is growing, fueled by massive increases in data from AI and sensors everywhere. The challenge now, particularly in multi-die assemblies, is how to prioritize where signals go, how quickly they move, and when they're supposed to arrive at shared memories. Andy Nightingale, vice president of product management and marketing at Arteris... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy