tag: ASML

EUV Reaches A Crossroads
By Mark LaPedus - 20 Mar, 2014 - Comments: 3

[gettech id="31045" comment="EUV"] (EUV) [getkc id="80" comment="lithography"] is at a crossroads. 2014 represents a critical year for the technology. In fact, it may answer a pressing question about EUV: Does it work or not? It’s too early to make that determination right now, but there are more uncertainties than ever for the oft-delayed technology. Originally aimed for the 65nm node in... » read more

Advanced Lithography: Moore’s Law Moves On
By Marc David Levenson - 20 Mar, 2014 - Comments: 1

Every February, experts in nano patterning technologies converge in San Jose, Calif., to present their road maps, brainstorms and results at the SPIE Advanced Lithography Symposium. This year, there was more confusion than ever, partly the result of sessions in unlabeled (but beautiful) new ballrooms at the Convention Center, but mostly because of industry divergences. There is no longer a s... » read more

The Final Deadline For EUV
By Ed Sperling - 27 Feb, 2014 - Comments: 5

When TSMC disclosed this week—in a public forum—that its production EUV lithography test had failed in one of the early test runs due to a power source issue, there were very different reactions. EUV, after all, is an emotional issue with billions of dollars invested and lots of jobs riding on this technology. To begin with, there has been the usual spin control. The message essentially ... » read more

Manufacturing Bits: Feb. 25
By Mark LaPedus - 25 Feb, 2014 - Comments: 0

Intel joins DSA consortium Arkema, ASML, Intel and others have formed a new consortium in the emerging directed self-assembly (DSA) arena.The group, dubbed PLACYD, is a European funded consortium. Part of the Seventh Framework European Programme (FP7) and funded by ENIAC JU (European Technology Platform for Nanoelectronics), the project includes Arkema, CEA-Leti, STMicroelectronics, Intel,... » read more

EUV Suffers New Setback
By Mark LaPedus - 24 Feb, 2014 - Comments: 8

ASML Holding’s initial, production-worthy extreme ultraviolet (EUV) lithography tool has suffered a setback during a recent trial run at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). TSMC disclosed the problem during a public presentation at the 2014 Advanced Lithography conference in San Jose, Calif. During the trial run at TSMC, the EUV source crashed due to a misalignment of the l... » read more

IMEC’s 30th Anniversary: A Consortium With Impact
By Michael Watts - 01 Feb, 2014 - Comments: 0

In the history of semiconductor technology, one of the critical non-technology changes was the point when the biggest companies realized that they could not afford to do all the basic R&D. They agreed to collaborate in “pre-competitive” phase development through consortia such as IMEC and Sematech. IMEC is celebrating its 30th anniversary, and it’s interesting to recognize the signifi... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 24 Jan, 2014 - Comments: 0

Look for a nasty political campaign in Idaho, according to Bloomberg. Business leaders from Micron Technology and others in Idaho are endorsing the incumbent Republican candidate over a Tea Party challenger. The challenger, Bryan Smith, is a conservative Republican running for Idaho’s second congressional district. He is running against 16-year incumbent Mike Simpson. Simpson is supposedly pr... » read more

Week In Review: Manufacturing And Design
By Mark LaPedus - 20 Dec, 2013 - Comments: 0

Wearable computing is one of the hottest topics being discussed today. Angela McIntyre, research director at Gartner, said digital health and fitness will be among the hottest segments in the arena. Don't look now, but ASML Holding has delayed its 450mm tool programs. "As for 450, ASML has paused the development of 450mm lithography systems, both EUV and 193, until customer demand and the ti... » read more

DSA, Multi-beam Make Steady Progress
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss current and future lithography challenges with Laurent Pain, lithography lab manager at CEA-Leti. What follows are excerpts of that conversation. SE: CEA-Leti has two major programs in lithography. One is in directed self-assembly (DSA) and the other is in multi-beam e-beam. Let’s start with multi-beam. What is Leti doing in multi-beam and what... » read more

Defective R&D Funding Models
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

For years, the semiconductor equipment industry has been dealing with an R&D funding gap. Here’s the basic problem: Chipmakers demand certain tools for their next-generation processes, but they are not always willing to foot a large percentage of the R&D bill. And so, the equipment vendors develop the tools and assume a large part of R&D funding--and the risks. Fair or unf... » read more

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