Chip Industry Week in Review

By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Chip Industry Week in Review

By The SE Staff - 01 May, 2026 - Comments: 0

Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Chip Industry Week in Review

By The SE Staff - 02 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

Next Steps For Panel-Level Packaging

By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 29 Oct, 2021 - Comments: 0

Chipmakers After years in the works, GlobalFoundries is finally a public company. But on its first day of trading on Thursday (Oct. 28), shares of the foundry vendor slipped a bit. GF finished its first day of trading at $46.40. This compares to the $47 per share it priced in the initial public offering (IPO), according a report to Reuters. The chipmaker has a market capitalization of about $2... » read more

Manufacturing Bits: Aug. 24

By Mark LaPedus - 24 Aug, 2021 - Comments: 0

Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Week In Review: Auto, Security, Pervasive Computing

By SE Staff - 11 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Xilinx introduced its Versal AI Edge series of adaptive SoCs, or adaptive compute acceleration platforms (ACAPs), that can be manage AI-ML workloads in edge applications. The chip is designed for flexible, low latency, edge applications where algorithms may need updating. The software programmable chips have an AI Engine-ML featur... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 28 Jun, 2019 - Comments: 0

Market research What’s the CapEx outlook for 2020? Semiconductor capital spending is down in 2019, but the industry faces another slump in 2020, according to IC Insights. The firm sees a 15% decline in CapEx for 2019 with a 5% drop expected in 2020. New 300mm fab construction in Korea is still going strong despite the memory downturn, according to SEMI. “Korea’s fab construction spen... » read more

OLEDs Shine In Phones, TVs, Lights

By Jeff Dorsch - 20 Oct, 2016 - Comments: 0

OLEDs are coming—everywhere. While the new iPhone 7 models do not have organic light-emitting diode (OLED) displays, those handsets are likely to be the last Apple will offer before it makes the smartphone transition to OLED displays next year. The Apple Watch, however, does have a flexible OLED display with a sapphire crystal cover or an Ion-X glass cover, and the Apple Watch Series 2 ... » read more

Joint R&D Has Its Ups And Downs

By Jeff Dorsch - 07 Sep, 2016 - Comments: 0

As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

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Chip Industry Week in Review

Chip Industry Week in Review

Chip Industry Week in Review

Next Steps For Panel-Level Packaging

Week In Review: Manufacturing, Test

Manufacturing Bits: Aug. 24

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

OLEDs Shine In Phones, TVs, Lights

Joint R&D Has Its Ups And Downs

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