FPGAs Find New Workloads In The High-Speed AI Era


FPGAs are finding new applications in the age of artificial intelligence, high-speed wireless communications, medical and life science technology, and in complex chip architectures where they can improve the flow of data. Field-programmable gate arrays (FPGAs) enable designers to reprogram or reconfigure digital logic after the chips have been deployed, which is essential in the AI world, wher... » read more

Shaping The Future Of AI Processors: A Tech Threads Conversation With Jim Keller


I had the pleasure of hosting renowned computer architect and Tenstorrent CEO Jim Keller, on the latest episode of Baya Systems’ Tech Threads podcast. If you haven’t already, listen to get his insights on the need for “open” intelligence architectures and what would be needed to drive the semiconductor industry forward. What is an “open” intelligent architecture and ecosystem? As... » read more

From Bottleneck to Breakthrough: Scalable Fabric IP for High- Bandwidth AI and HPC Systems


As compute density and heterogeneity grow rapidly in modern SoCs targeting high-performance computing (HPC) and artificial intelligence (AI) workloads, efficient data movement has emerged as a critical performance and power bottleneck. With increasing core counts, high-speed accelerators, and complex memory hierarchies, traditional bus and crossbar-based interconnects fail to scale, resulting i... » read more

Chip Industry Week in Review


Samsung reportedly is hiking memory chip prices by 30% to 60% due to high demand from AI data centers and constrained supplies. Those shortages are causing ripples elsewhere. SMIC, China's largest foundry, said its customers are holding back orders for other types of semiconductor due to concerns about memory supplies. Meanwhile, interest in photonics and power semiconductors is picking up, ... » read more

Multiple AI Scale-Up Options Emerge


Artificial intelligence (AI) workloads are very different from those traditionally run inside of data centers, and while the current infrastructure can accommodate those needs, there is a constant demand for higher performance and better power efficiency. It can take months to train a large language model, even with a huge number of processing elements. Typically this involves commandeering ... » read more

Chip Industry Week in Review


SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

Small Vs. Large Language Models


The proliferation of edge AI will require fundamental changes in language models and chip architectures to make inferencing and learning outside of AI data centers a viable option. The initial goal for small language models (SLMs) — roughly 10 billion parameters or less, compared to more than a trillion parameters in the biggest LLMs — was to leverage them exclusively for inferencing. In... » read more

Even With AI Inroads, Human Chip Designers Still Essential


The proliferation of AI tools seems perfectly matched to fill a talent shortage, but a closer look shows the skills do not entirely overlap. Certain parts of the EDA pipeline require human engineers, and it seems likely to stay that way for the foreseeable future. The dark art of analog design, the final word on safety-critical functional safety, high-level architectural decisions, product i... » read more

Developing RISC-V Compute Subsystems


As demand grows for scalable, efficient, and customized compute, more companies are turning to RISC-V as the preferred architecture for high-performance computing. Tenstorrent and Baya Systems have designed a compute subsystem combining IP from both companies designed to enable AI and HPC use cases. The solution leverages Tenstorrent’s Ascalon processor and Baya’s advanced interconnect tech... » read more

Startup Tips To Get From Seed Funding To Series A, B, C


Startups are often created by experienced engineers who figure out how to solve a technical problem they are dealing with at work, or by PhD candidates in research labs before they have even started their first full-time job. Either way, getting seed money to the tune of a few million dollars is relatively easy compared to securing further rounds of funding and achieving the company’s exit go... » read more

← Older posts Newer posts →