Chip Industry Week In Review

By The SE Staff - 27 Feb, 2026 - Comments: 0

Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

AI Starting To Simplify Design Of Programmable Logic

By Liz Allan - 26 Feb, 2026 - Comments: 0

Key Takeaways AI/ML and agentic tools are getting better at helping design and compile FPGAs, but downstream programming is slower to benefit. FPGAs historically have been designed using Verilog or VHDL, but higher-level languages could push more intelligence into compilers. ML tools can also help with mixed-signal co-design by automatically tuning DSP algorithms based on analog simu... » read more

Can A Computer Science Student Be Taught To Design Hardware?

By Liz Allan - 17 Feb, 2026 - Comments: 2

Key Takeaways New approaches are being devised and tested to address the talent shortage. Leveraging AI in design tools will help engineers become more efficient, and potentially could reduce the time it takes to train engineering students. EDA companies are looking at whether it's possible to train computer science and software engineers to become hardware engineers. A vari... » read more

AI’s Impact On Engineering Jobs May Be Different Than Expected

By Liz Allan - 29 Jan, 2026 - Comments: 0

Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil... » read more

Chip Industry Week in Review

By The SE Staff - 16 Jan, 2026 - Comments: 0

Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S. The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Annual Global IC Fabs And Facilities Report

By Liz Allan - 07 Jan, 2026 - Comments: 0

Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Programmable Chips Evolve For Shifting Needs

By Liz Allan - 23 Dec, 2025 - Comments: 0

ICs and SoCs are utilizing a range of processing elements that allow them to optimize current workloads while hedging their bets for the future. What used to be a simple choice between an ASIC, FPGA, or DSP, has evolved into a mix of processor types and architectures, including varying levels of programmability and customization. Speed is essential, but technology is evolving so quickly that... » read more

FPGAs Find New Workloads In The High-Speed AI Era

By Liz Allan - 25 Nov, 2025 - Comments: 0

FPGAs are finding new applications in the age of artificial intelligence, high-speed wireless communications, medical and life science technology, and in complex chip architectures where they can improve the flow of data. Field-programmable gate arrays (FPGAs) enable designers to reprogram or reconfigure digital logic after the chips have been deployed, which is essential in the AI world, wher... » read more

Shaping The Future Of AI Processors: A Tech Threads Conversation With Jim Keller

By Nandan Nayampally - 25 Nov, 2025 - Comments: 0

I had the pleasure of hosting renowned computer architect and Tenstorrent CEO Jim Keller, on the latest episode of Baya Systems’ Tech Threads podcast. If you haven’t already, listen to get his insights on the need for “open” intelligence architectures and what would be needed to drive the semiconductor industry forward. What is an “open” intelligent architecture and ecosystem? As... » read more

From Bottleneck to Breakthrough: Scalable Fabric IP for High- Bandwidth AI and HPC Systems

By Baya Systems - 24 Nov, 2025 - Comments: 0

As compute density and heterogeneity grow rapidly in modern SoCs targeting high-performance computing (HPC) and artificial intelligence (AI) workloads, efficient data movement has emerged as a critical performance and power bottleneck. With increasing core counts, high-speed accelerators, and complex memory hierarchies, traditional bus and crossbar-based interconnects fail to scale, resulting i... » read more

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