tag: Cadence Design Systems

Firmware Skills Shortage
By Brian Bailey - 25 Feb, 2021 - Comments: 0

Good hardware without good software is a waste of silicon, but with so many new processors and accelerator architectures being created, and so many new skills required, companies are finding it hard to hire enough engineers with low-level software expertise to satisfy the demand. Writing compilers, mappers and optimization software does not have the same level of pizazz as developing new AI ... » read more

When Is Verification Done?
By Ann Mutschler - 25 Feb, 2021 - Comments: 0

Even with the billions of dollars spent on R&D for EDA tools, and tens of billions more on verification labor, only 30% to 50% of ASIC designs are first time right, according to Wilson Research Group and Siemens EDA. Even then, these designs still have bugs. They’re just not catastrophic enough to cause a re-spin. This means more efficient verification is needed. Until then, verificati... » read more

5G NR Design For eMBB
By Cadence - 24 Feb, 2021 - Comments: 0

This white paper examines the design challenges for eMBB products and provides examples of how these challenges can be overcome using the co-design capabilities in Cadence AWR Design Environment software. Click here to download with registration. » read more

Usage Models Driving Data Center Architecture Changes
By Ann Mutschler - 11 Feb, 2021 - Comments: 0

Data center architectures are undergoing a significant change, fueled by more data and much greater usage from remote locations. Part of this shift involves the need to move some processing closer to the various memory hierarchies, from SRAM to DRAM to storage. There is more data to process, and it takes less energy and time to process that data in place. But workloads also are being distrib... » read more

The Problem With Benchmarks
By Brian Bailey - 11 Feb, 2021 - Comments: 1

Benchmarks long have been used to compare products, but what makes a good benchmark and who should be trusted with their creation? The answer to those questions is more difficult than it may appear on the surface, and some benchmarks are being used in surprising ways. Everyone loves a simple, clear benchmark, but that is only possible when the selection criteria are equally simple. Unfortuna... » read more

Optimizing Power Supply
By Cadence - 10 Feb, 2021 - Comments: 0

Any electrical engineer knows providing power to your board is a key feature in PCB design. While most boards can be functional, their true quality shines when the perfect level of power to components is achieved. Building and designing better power supplies is the best way to ensure the end-product has full life-cycle potential. But how do we ensure we can convert a (potentially variable) i... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 05 Feb, 2021 - Comments: 0

Security Microsoft and Synopsys are working together on a secure cloud-based chip development environment for United States Department of Defense’s Rapid Assured Microelectronics Prototypes (RAMP) program. “Through this integration on the RAMP program, Synopsys' trusted design, verification and silicon IP solutions will be available in Microsoft Azure," said Mujtaba Hamid, head of Silicon ... » read more

Longer Chip Lifecycles Increase Security Threat
By Ed Sperling - 04 Feb, 2021 - Comments: 0

The longer chips and electronic systems remain in use, the more they will need to be refreshed with software and firmware updates. That creates a whole new level of security risks, ranging from over-the-air intercepts to compromised supply chains. These problems have been escalating as more devices are connected to the Internet and to each other, but it's particularly worrisome when it invol... » read more

Edge-Inference Architectures Proliferate
By Bryon Moyer - 04 Feb, 2021 - Comments: 0

First part of two parts. The second part will dive into basic architectural characteristics. The last year has seen a vast array of announcements of new machine-learning (ML) architectures for edge inference. Unburdened by the need to support training, but tasked with low latency, the devices exhibit extremely varied approaches to ML inference. “Architecture is changing both in the comp... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design
By Cadence - 03 Feb, 2021 - Comments: 0

Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

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