Spreadsheets: Still Valuable, But More Limited


Spreadsheets have been an invaluable engineering tool for many aspects of semiconductor design and verification, but their inability to handle complexity is squeezing them out of an increasing number of applications. This is raising questions about whether they still have a role, and if so, how large that role will be. There are two sides to this issue. On one side are the users who see them... » read more

Design Challenges Increasing For Mixed-Die Packages


The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design


In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

Blog Review: Feb. 9


Arm's Mark Inskip walks through how the Morello program built a demonstration of the architecture that enables fine-grained memory protection and highly scalable software compartmentalization based on the CHERI (Capability Hardware Enhanced RISC Instructions) architectural model, from IP development and SoC design to creating software and a demonstration board. Synopsys' Plamen Asenov and su... » read more

Data Security Challenges In Automotive


Automakers are scrambling to prevent security breaches and data hacks in new vehicles while simultaneously adding new and increasingly autonomous features into vehicles that can open the door to new vulnerabilities. These two goals are often at odds. As with security in any complex system, nothing is ever completely secure. But even getting a handle on this multilayered issue is a challenge.... » read more

Ensuring Functional Safety For Automotive AI Processors


Safety is critically important across the automotive, industrial, and aerospace and defense industries. For instance, Cadence's work with Hailo illustrates how advances in semiconductor technology and EDA deliver safe electronics without compromising low power and cost. Hailo's automotive webpage starts with the words "The pursuit for 'vision zero,'" reflecting that European road fatalitie... » read more

Blog Review: Feb. 2


Synopsys' Stelios Diamantidis shares some predictions for AI in 2022, including the three markets that will push new AI chips, the increasing need for trust chains, the entry of non-traditional companies, and the impact of AI in chip design. Siemens EDA's Ray Salemi checks out how Python and SystemVerilog can work together to boost the verification ecosystem by taking advantage of what each ... » read more

A New Dimension Of Complexity For IC Design


Full 3D designs involving logic-on-logic are still in the tire-kicking stage, but gaps in the tooling already are showing up. This is especially evident with static timing analysis (STA), which is used to validate a design’s timing performance by checking all possible paths for timing violations. STA issues began popping up particularly with the introduction of hybrid bonding, a bumpless p... » read more

Growth Spurred By Negatives


The success and health of the semiconductor industry is driven by the insatiable appetite for increasingly complex devices that impact every aspect of our lives. The number of design starts for the chips used in those devices drives the EDA industry. But at no point in history have there been as many market segments driving innovation as there are today. Moreover, there is no indication this... » read more

Three Technologies Enabling The Next Decade Of Hyperconnectivity


As it has become a tradition in my 15 years of blogging, January is a month of both reflection and outlook. At the beginning of 2022, I am excited that key themes from 5 and 10 years ago—3D integration, artificial intelligence and machine learning (AI/ML), and ubiquitous needs for more connectivity driving 4G and 5G networks—clearly have exceeded expectations and forecasts from that time. L... » read more

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