tag: Cadence

Are Sustainability And Safety Gen Z’s Top Requirements In 2031?
By Frank Schirrmeister - 24 Feb, 2022 - Comments: 0

This blog is my 125th on the "Frankly Speaking" channel on SemiEngineering. A big thanks to Ed and his team for a great run and for putting up with my musings! I had started work-related blogging back in 2008, more company-specific, and some of these have since then vanished from the internet. Who would have thought! For this anniversary, I am looking forward ten years to 2031 and how generatio... » read more

RF To mmWave Design For Systems
By Cadence - 23 Feb, 2022 - Comments: 0

RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today’s electronic systems often integra... » read more

Blog Review: Feb. 23
By Jesse Allen - 23 Feb, 2022 - Comments: 0

Synopsys' Varun Agrawal looks at four new technologies have emerged to support the demands on 5G networks and applications, the challenges in validating all of those technologies together, and what's needed to perform end-to-end testing effectively for 5G O-RAN SoCs. Siemens EDA's Ray Salemi points to how FPGA retargeting could help address supply chain difficulties and some of the challenge... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Feb, 2022 - Comments: 0

AMD completed its acquisition of Xilinx. The all-stock deal ended up being valued at approximately $50 billion due to a rise in AMD's share price (the deal was valued at $35 billion when announced). The Xilinx business will become the newly formed Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng, and will continue its FPGA, adaptive SoC, and software roadmaps a... » read more

Preparing For 3D-ICs
By Ed Sperling - 16 Feb, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Blog Review: Feb. 16
By Jesse Allen - 16 Feb, 2022 - Comments: 0

Arm's Mark Nicholson explains the software side of the Morello project to implement a prototype security-focused architecture, presenting a high-level view of the software stacks and discussing the status and roadmap of a range of activities. Synopsys' Ron Lowman finds that as IoT technology and capabilities of portable devices expand, the deployment of 5G networks and interest in AI and aut... » read more

Improving PPA In Complex Designs With AI
By John Koon - 14 Feb, 2022 - Comments: 0

The goal of chip design always has been to optimize power, performance, and area (PPA), but results can vary greatly even with the best tools and highly experienced engineering teams. Optimizing PPA involves a growing number of tradeoffs that can vary by application, by availability of IP and other components, as well as the familiarity of engineers with different tools and methodologies. Fo... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Feb, 2022 - Comments: 0

Nvidia's proposed acquisition of Arm is officially off. The deal faced significant pushback from regulatory agencies in the UK, USA, and Europe, which feared it would reduce or limit competition in areas like data center. Nvidia indicated it would continue working with Arm, and it will retain a 20-year Arm license. (SoftBank will retain the $1.25 billion prepaid by Nvidia.) SoftBank said it wil... » read more

CFD Playing Increasing Role In Design
By Ann Mutschler - 10 Feb, 2022 - Comments: 0

With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Why Data Center Power Will Never Come Down
By Bryon Moyer - 10 Feb, 2022 - Comments: 3

Data centers have become significant consumers of energy. In order to deal with the proliferation of data centers and the servers within them, there is a big push to reduce the energy consumption of all data center components. With all that effort, will data center power really come down? The answer is no, despite huge improvements in energy efficiency. “Keeping data center power consum... » read more

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