Security Gaps In Open Source Hardware And AI


Semiconductor Engineering sat down to discuss security risks across multiple market segments with Helena Handschuh, security technologies fellow at Rambus; Mike Borza, principal security technologist for the Solutions Group at Synopsys; Steve Carlson, director of aerospace and defense solutions at Cadence; Alric Althoff, senior hardware security engineer at Tortuga Logic; and Joe Kiniry, princi... » read more

Silo Busting In The Design Flow


An increasing number of dependencies in system design are forcing companies, people, tools, and flows to become more collaborative. Design and EDA companies must adapt to this new reality because it has become impossible for anyone to do it all by themselves. Moreover, what happens in manufacturing and packaging needs to be considered up front, and what gets designed in the design phase may ... » read more

System Design For Next-Generation Hyperscale Data Centers


As we are in the process of hyperscaling the large volumes of data that our devices and sensors create, processing this data along the way at far and near edges, and transmitting the hard-to-imagine volumes of data through networks to data centers for processing, the data center itself is undergoing a fundamental shift with new networking and architecture co-design opportunities. In a previous ... » read more

Using AI And Bugs To Find Other Bugs


Debug is starting to be rethought and retooled as chips become more complex and more tightly integrated into packages or other systems, particularly in safety- and mission-critical applications where life expectancy is significantly longer. Today, the predominant bug-finding approaches use the ubiquitous constrained random/coverage driven verification technology, or formal verification techn... » read more

Computational Software


Electronics technology is evolving rapidly, becoming pervasive in our lives. There are more smart phones in use than there are people on earth, driver assistance is now common in automobiles, commercial airplanes have increasingly sophisticated infotainment, and wearable health monitors exist for a plethora of missions. Every device is generating and communicating massive amounts of data, inclu... » read more

Blog Review: Nov. 18


Arm's Roberto Lopez Mendez finds that holographic displays can now be achieved on mobile processors thanks to recent algorithmic and computational advances. Mentor's Colin Walls examines the reasons the consolidate a number of automotive sub-systems onto a smaller number of powerful ECU to reduce complexity and increase system reliability. Cadence's Paul McLellan takes a look at the devel... » read more

The Next Big Leap: Energy Optimization


The relationship between power and energy is technically simple, but its implication on the EDA flow is enormous. There are no tools or flows today that allow you to analyze, implement, and optimize a design for energy consumption, and getting to that point will require a paradigm shift within the semiconductor industry. The industry talks a lot about power, and power may have become a more ... » read more

Week In Review: Design, Low Power


M&A Synopsys acquired Moortec, a provider of in-chip monitoring technology specializing in process, voltage and temperature (PVT) sensors. Moortec's sensors will be a key component to Synopsys' new Silicon Lifecycle Management (SLM) platform. "This acquisition accelerates the expansion of our SLM platform by providing our customers with a comprehensive data-analytics-driven solution for de... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Cadence achieved ASIL Level B in support of D (ASIL B(D))-compliant certification for its Tensilica ConnX B10 and ConnX B20 DSPs, which are designed for automotive radar, lidar, and vehicle-to-everything (V2X). SGS-TÜV Saar certified that the DSPs have support for random hardware faults and systematic faults. Synopsys is acquiring Moortec, whose process, voltage, and temperature... » read more

Designs Beyond The Reticle Limit


Designs continue to grow in size and complexity, but today they are reaching both physical and economic challenges. These challenges are causing a reversal of the integration trend that has provided much of the performance and power gains over the past couple of decades. The industry, far from giving up, is exploring new ways to enable designs to go beyond the reticle size, which is around 8... » read more

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