tag: Cadence

The Week In Review: Design/IoT
By Jesse Allen - 08 Jan, 2016 - Comments: 0

EDA & IP EDA revenues increased 7.1% for Q3 2015, according to the EDA Consortium, upping the number to $1957.5 million, compared to $1828.1 million in Q3 2014. The four-quarters moving average also jumped by 8.8%. IC Physical Design & Verification saw the biggest gains, with a 14% increase compared to Q3 2014 and $407.9 million in revenue for the quarter. IP was runner up, with $652... » read more

Sensors Enable ADAS
By Ann Mutschler - 07 Jan, 2016 - Comments: 0

Under the hood, cars of today look nothing like those of a few decades ago. There are sophisticated safety and drivetrain monitoring features, software for interpreting and interacting with the outside world and modifying the inside environment, and a host of features that might have seemed impossible or even ridiculous in the past. And there's much more to come. Advanced driver assistance s... » read more

Blog Review: Jan. 6
By Jesse Allen - 06 Jan, 2016 - Comments: 0

Mobile is not just about handsets, but also cloud datacenters and the networking to move data back and forth. Cadence's Paul McLellan takes a look at the future of traditional dataservers with the rise of microservers and the use of FPGA accelerators. Mentor's Jay Gorajia has ideas for how to best leverage manufacturing analytics, but says that care must be taken in deciding which data shoul... » read more

CEO Outlook: 2016
By Ed Sperling - 04 Jan, 2016 - Comments: 1

Semiconductor Engineering talked with 10 CEOs from all sides of the Semiconductor Industry for a high-level view of what to expect this year—good and bad. What follows are excerpts of those conversations, which were compiled over the past month. Scott McGregor, president and CEO of Broadcom "We're going to see more M&A. In the past, you only did deals that made sense strategically or ... » read more

Upcoming Hurdles For The Semiconductor Industry
By Ann Mutschler - 30 Dec, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael Buehle... » read more

Blog Review: Dec. 30
By Jesse Allen - 30 Dec, 2015 - Comments: 0

It's been a quiet week on the blog front. If you're looking for a bit of downtime while you enjoy the New Year, we present thoughts on what's happened this year and what may be to come from last week's System-Level Design newsletter: Editor in Chief Ed Sperling finds acquisitions and the leading edge of design defined 2015, but other changes are ahead. Technology Editor Brian Bailey obser... » read more

Blog Review: Dec. 24
By Jesse Allen - 24 Dec, 2015 - Comments: 0

Jeff Ravencraft, the President and COO of USB-IF, sat down for a video interview with Cadence's Jacek Duda to discuss the the role of the organization and what's in the works for USB. Check out the second part, too. Have all the avenues been exhausted in the search for greater layout productivity? Synopsys' Graham Etchells sees no revolutionary technology in the area since CALMA, but highlig... » read more

Bridging Hardware And Software
By Ann Mutschler - 22 Dec, 2015 - Comments: 0

Since the advent of embedded systems there has been a struggle between hardware engineers trying to understand the mindset of their software counterparts, and vice versa. That struggle is alive and well today—and it's costing everyone money. This divide is rife with passion, territoriality and misunderstanding. It has delayed tapeouts, created errors and inefficiencies that take time and e... » read more

Why Test Is Changing
By Ann Mutschler - 22 Dec, 2015 - Comments: 0

Test is undergoing a revolution in terms of how it is perceived, how it is performed and where it is done. For years, test was something of an afterthought. It was a separate operation that was done after the design was finished, or it was a self-contained module that had to be characterized for power, heat and electrical effects, but not much else. As more chips find their way into markets ... » read more

Outlook 2016 – The year of Horizontal and Vertical Flow Integration
By Frank Schirrmeister - 22 Dec, 2015 - Comments: 0

As 2015 comes to an end rapidly, the key question becomes what the next year will bring. Last year around this time, in my blog “The Next Big Shift In Verification”, I talked about software-driven verification as the next era of verification that follows the eras of directed testing and High-level Verification Language (HVL) driven verification. I also had referred to our System Development... » read more

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