tag: Cadence

Security In 2.5D
By Ed Sperling - 12 Oct, 2015 - Comments: 2

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no. Put in perspective, all chips are vulnerable to [getkc id="253" kc_name="side channel attacks"], hacking of memory—a risk that increases... » read more

The Week In Review: Design/IoT
By Jesse Allen - 09 Oct, 2015 - Comments: 0

Imec and Cadence completed the first tapeout of a 5nm test chip. Using a processor design, the companies taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning. Tools Synopsys folded in recent acquisition Atrenta's testabilit... » read more

The Challenge Of Updating Cars
By Ann Mutschler - 08 Oct, 2015 - Comments: 0

News stories about automotive hacking are becoming more common, and so is the concern about how to curb this problem. Security has become a new layer of system design complexity, and it's being taken increasingly seriously in a market that until very recently largely ignored it. That attitude is changing rapidly though, particularly with the advent of autonomous and connected vehicles. Secu... » read more

The Rise Of Dynamic Networks
By Ernest Worthman - 08 Oct, 2015 - Comments: 0

The Internet of the future, and particularly the [getkc id="260" comment="Internet of Everything"], will be interlaced with millions if not billions of intelligent, dynamic, self-organizing networks. These networks will be full of elements that are capable of autonomic self-registration across these multitudes of networks. It is one thing to put up a security perimeter when you know who the... » read more

Rolling Out Automotive Security
By Ann Mutschler - 08 Oct, 2015 - Comments: 0

The automotive world has traditionally been a secretive place as automakers made it their mission to hold design plans as close to their vests as possible. With complexity in the automotive design process, that tradition has been changing as automakers work ever more closely with their ecosystem. In one example, Adam Sherer, product management group director for automotive safety in the S... » read more

How Long Will FinFETs Last? (Part 3)
By Ann Mutschler - 07 Oct, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss how long [getkc id="185" kc_name="FinFET"]s will last and where we will we go next with Vassilios Gerousis, Distinguished Engineer at [getentity id="22032" e_name="Cadence"]; Juan Rey, Sr. Director of Engineering for Calibre R&D at [getentity id="22017" e_name="Mentor Graphics"]; Kelvin Low, Senior Director Foundry Marketing at [getentity id="22... » read more

Blog Review: Oct. 7
By Jesse Allen - 07 Oct, 2015 - Comments: 0

Ansys' Sunil Nakum takes a look at backing up the brain and concludes that we would need to keep following Moore's Law for a long time given the current approaches and leave several questions unanswered. There is a battle brewing between high-efficiency LED lighting and vintage-style Edison bulbs. With the latest lighting fad, Mentor's John McMillan asks, is style and nostalgia beating high-... » read more

Power Estimation: Early Warning System Or False Alarm?
By Brian Bailey - 02 Oct, 2015 - Comments: 0

Semiconductor Engineering sat down with a large panel of experts to discuss the state of power estimation and to find out if the current levels of accuracy are sufficient to being able to make informed decisions. Panelists included: Leah Schuth, director of technical marketing in the physical design group at [getentity id="22186" comment="ARM"]; Vic Kularni, senior vice president and general ma... » read more

Executive Insight: Lip-Bu Tan
By Ed Sperling - 01 Oct, 2015 - Comments: 1

Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to talk about consolidation, Moore's Law, and where the opportunities are in the IoT and automotive markets. What follows are excerpts of that conversation. SE: What are the big concerns for the semiconductor industry in general, and EDA in particular? Tan: Top on my list is all the consolidation that's goin... » read more

Blog Review: Sept. 30
By Jesse Allen - 30 Sep, 2015 - Comments: 0

In an increasingly networked world, NXP's Lars Reger advocates for a change of perspective: one which places data protection and the security of end customers and users at the heart. Differential power analysis has been on the mind of Rambus' Aharon Etengoff recently as increasing numbers of SIM cards are being cracked, plus some counter measures that can be used. Even wondered about the ... » read more

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