tag: Cadence

Experts At The Table: Retrofitting Older Process Nodes
By Ed Sperling - 16 Sep, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; Vishal Kapoor, vice president of marketing for SoC realization at Cadence; Naveed Sherwani, CEO of Open-Silicon; John Heinlein, vice president of marketing at ARM; and Jeff Lukanc, director of engineering at IDT. What follows are excerpts of that conversation, which was held in... » read more

TSVs Ease Heat In 3D ICs
By Ed Sperling - 08 Sep, 2011 - Comments: 0

By Ann Steffora Mutschler In the evolving discussion of 3D ICs and through silicon via (TSV) technology, a key issue engineering teams are facing today is how to reduce the thermal coefficients between substrates in a stacked die. Simply put, what is the best way to get the heat out of the 2.5 or 3D IC? The answer, of course, is anything but simple. “In a 3D system, the heat hierarchy ... » read more

Hierarchical LP Design 3
By Luke Lang - 08 Sep, 2011 - Comments: 0

By Luke Lang Last month, I wrote in favor of top-down approach to coding the power intent. This month, let’s take a look at the bottom-up approach. With the top-down approach, we code the full-chip power intent without having to worry about all the nets that cross power domain boundaries. Then we issue a few commands, and a tool writes out the block-level CPF. Pretty simple and straightfo... » read more

Experts At The Table: Retrofitting Older Process Nodes
By Ed Sperling - 08 Sep, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; Vishal Kapoor, vice president of marketing for SoC realization at Cadence; Naveed Sherwani, CEO of Open-Silicon; John Heinlein, vice president of marketing at ARM; and Jeff Lukanc, director of engineering at IDT. What follows are excerpts of that conversation, which was held in... » read more

Will Wide I/O Reduce Cache?
By Ed Sperling - 25 Aug, 2011 - Comments: 0

By Ann Steffora Mutschler In an ideal world, all new SoC technologies would make the lives of design engineers easier. While this may be true of some techniques, it is not the case with one advanced memory interface technology on the horizon, Wide I/O. There are claims that Wide I/O could reduce cache, but so far this is not widely understood. In fact, exactly how Wide I/O will be used, wha... » read more

Testing One, Two, Three
By Ed Sperling - 25 Aug, 2011 - Comments: 0

By Ed Sperling The rule of thumb at 90nm—still one of the mainstream process nodes—has been that test is something you do when a chip is done. You attach electrodes on either side, make sure the signal comes through clearly, and that the SoC functions properly. Try the same thing at 40nm, with multiple power islands, multiple voltage rails, lots of third-party IP and usually a slew of p... » read more

Experts At The Table: Multi-Foundry Strategies
By Ed Sperling - 22 Aug, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing and Design sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; John Murphy, director of strategic alliances marketing at Cadence; Michael Buehler-Garcia, director of Calibre design solutions marketing at Mentor Graphics; Bob Smith, vice president of marketing and business development at Magma, and Linh Hong, vice president ... » read more

Getting The Balance Right
By Ann Mutschler - 11 Aug, 2011 - Comments: 0

Defining the power architecture for a low-power design means striking a balance between the high-level abstraction and measurements made typically at RTL and below, but today that is easier said than done. “The balance is that at the high level of abstraction, the design choices you make have a big effect over power, yet your ability to measure them is incomplete until you get much further... » read more

Hierarchical LP Design 2
By Luke Lang - 11 Aug, 2011 - Comments: 0

By Luke Lang Last month, I discussed two key features of the Common Power Format (CPF) that support hierarchical design methodology: boundary port and macro model. These are commands that need to be written to describe the power intent and drive the tools. Without these commands, it is extremely difficult to do hierarchical design. But with these commands, hierarchical power intent files are n... » read more

Don’t Forget Test
By Ann Mutschler - 11 Aug, 2011 - Comments: 0

In the modeling of designs for power, engineers make sure to include real system modes and get real activity vectors but, according to Pete Hardee at Cadence, there are a few things they are forgetting. “If the only activity you are using is your simulation test vectors, those are probably pretty unrealistic and that’s a big source of error. One other thing we see—and this is quite imp... » read more

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