tag: ChipAgents

FPGAs Find New Workloads In The High-Speed AI Era
By Liz Allan - 25 Nov, 2025 - Comments: 0

FPGAs are finding new applications in the age of artificial intelligence, high-speed wireless communications, medical and life science technology, and in complex chip architectures where they can improve the flow of data. Field-programmable gate arrays (FPGAs) enable designers to reprogram or reconfigure digital logic after the chips have been deployed, which is essential in the AI world, wher... » read more

The Real-World Impact Of Silicon Lifecycle Management On Chip Architectures
By Ann Mutschler - 25 Nov, 2025 - Comments: 0

Silicon lifecycle management (SLM) is transforming chip architectures, empowering designers to build smarter, more resilient, and secure semiconductor devices by leveraging data from manufacturing to end of life in the field. That data can be used to improve future designs, reduce margin, and continuously optimize performance and power efficiency throughout a chip's lifetime. Moreover, under... » read more

Noise: A Chip Killer
By Brian Bailey - 13 Nov, 2025 - Comments: 0

Noise has always been important to communications experts, but it's quickly becoming an issue that every semiconductor designer has to contend with. Some chips already have been compromised. Noise can be defined as any deviation from the ideal that can impact intended functionality. When it comes to semiconductors, that could mean the ability to reliably extract a signal value at the intende... » read more

Small Vs. Large Language Models
By Ed Sperling - 03 Nov, 2025 - Comments: 0

The proliferation of edge AI will require fundamental changes in language models and chip architectures to make inferencing and learning outside of AI data centers a viable option. The initial goal for small language models (SLMs) — roughly 10 billion parameters or less, compared to more than a trillion parameters in the biggest LLMs — was to leverage them exclusively for inferencing. In... » read more

Thermal, Mechanical, And Material Stresses Grow With Die Stacking
By Ann Mutschler - 30 Oct, 2025 - Comments: 0

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause problems at any point during its expected lifetime. This includes everything from workload-dependent thermal gradients to mechanical and electrical stress, which may become more pronounced over time wi... » read more

Even With AI Inroads, Human Chip Designers Still Essential
By Liz Allan - 30 Oct, 2025 - Comments: 0

The proliferation of AI tools seems perfectly matched to fill a talent shortage, but a closer look shows the skills do not entirely overlap. Certain parts of the EDA pipeline require human engineers, and it seems likely to stay that way for the foreseeable future. The dark art of analog design, the final word on safety-critical functional safety, high-level architectural decisions, product i... » read more

Chip Industry Week in Review
By The SE Staff - 24 Oct, 2025 - Comments: 0

Retaliations and countermoves leading up to planned trade talks between the U.S. and China led experts to wonder, 'Who's winning?' New activity on this front: China issued questionnaires to some U.S. semiconductor firms as part of an anti-dumping probe, demanding detailed data on sales, profit margins, logistics costs and Chinese customer names for analog chips. The probe appears aimed at ... » read more

Multiple Challenges Emerge With Physical AI System Design
By Ann Mutschler - 22 Oct, 2025 - Comments: 0

Physical AI holds the promise of making everything from robots to a slew of mobile edge devices much more interactive and useful, but it will significantly alter how systems are designed, verified, and monitored. Physical AI systems need to work both independently and together. They need the ability to make decisions quickly and locally, typically using much less power than other types of AI... » read more

Startup Tips To Get From Seed Funding To Series A, B, C
By Liz Allan - 16 Oct, 2025 - Comments: 0

Startups are often created by experienced engineers who figure out how to solve a technical problem they are dealing with at work, or by PhD candidates in research labs before they have even started their first full-time job. Either way, getting seed money to the tune of a few million dollars is relatively easy compared to securing further rounds of funding and achieving the company’s exit go... » read more

AI Agents For UVM Generation: Challenges And Opportunities
By Kexun Zhang - 25 Sep, 2025 - Comments: 0

By Yuheng Tang and Kexun Zhang In the last two years, the role of AI tools in developers' workflows has rapidly expanded. What were once simple "code completion" engines have since evolved into agents that can read documentation, test their own code, and improve via self-reflection. While AI has already begun enhancing RTL design workflows, its exploration in verification remains in early st... » read more

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