CEO Outlook On Chip Industry (Part 1)

By Ed Sperling - 24 May, 2018 - Comments: 1

Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: What are the big changes ahead, and where do you see th... » read more

The Week In Review: IoT

By Jeff Dorsch - 07 Jul, 2017 - Comments: 0

Mergers and Acquisitions ARM has acquired Simulity Labs, an Internet of Things security firm in the United Kingdom, for about $15.2 million, a small part of which is held back for a year subject to certain conditions. Foresight Group, a private equity firm, acquired Simulity eight months ago for around $5.2 million, making a handsome profit on the transaction. Simulity provides embedded operat... » read more

What Cognitive Computing Means For Chip Design

By Ann Mutschler - 30 Mar, 2016 - Comments: 1

Cognitive computing. Artificial intelligence. Machine learning. All of these are concepts aim to make human types of problems computable, whether it be a self-driving car, a health care-providing robot, or a walking and talking assistant robot for the home or office. R&D teams around the world are working to create a whole new world of machines more intelligent than humans. Designing sys... » read more

Why Use A Package?

By Ed Sperling - 21 Jan, 2016 - Comments: 0

Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: cognitive computing

CEO Outlook On Chip Industry (Part 1)

The Week In Review: IoT

What Cognitive Computing Means For Chip Design

Why Use A Package?