Chip Industry Week In Review


ECTC Panel-level packaging, hybrid bonding, new substrates, and fine-pitch interconnects topped the list of advanced packaging technologies at ECTC this week. Among the announcements: ASE launched an automated 310mm × 310mm panel-level packaging production line. Expected to enter production in the first half of 2027, the line is compatible with FOCoS and FOCoS-Bridge pa... » read more

On The Ground At ECTC 2025


Senior Executive Editor Laura Peters examines the the hot topics at last week's IEEE's Electronic Components and Technology Conference, including the impact of hardware-software integration on power consumption, co-packaged optics, hybrid bonding, and fan-out panel-level packaging. https://youtu.be/yBDKqrPQBl4   » read more