RF To Millimeter-Wave Front-End Component Design Trends For 5G Communications

By Cadence - 28 Jul, 2021 - Comments: 0

This white paper discusses design challenges and solutions related to the "third wave" of communications, presenting several case studies in which the Cadence AWR Design Environment platform has been used to develop products for 5G and beyond. Examples include a multiband active antenna tuner for cellular internet of things (IoT) machine-type communications (mMTC) applications, a linear power a... » read more

5G NR Design For eMBB

By Cadence - 24 Feb, 2021 - Comments: 0

This white paper examines the design challenges for eMBB products and provides examples of how these challenges can be overcome using the co-design capabilities in Cadence AWR Design Environment software. Click here to download with registration. » read more

5G NR Design eMBB

By Cadence - 27 Jan, 2021 - Comments: 0

Next-generation 5G/6G communication systems will provide massive connectivity to the internet with extreme capacity, coverage, reliability, and ultra-low latency, enabling a wide range of new services made possible through innovative technologies. Enhanced mobile broadband (eMBB) extends the current mobile experience with high data throughput on the order of more than 10Gbps, high system capaci... » read more

What’s After 5G

By Bryon Moyer - 20 Jul, 2020 - Comments: 1

This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This is far from trivial. 5G only just recently entered the commercial world, and — especially with the higher millimeter-wave (mmWave) frequencies — it has ... » read more

Introduction To The NI mmWave Transceiver System Hardware

By NI - 10 Feb, 2020 - Comments: 0

Wireless technology is everywhere. Every day more and more new wireless devices are being created and accessing today’s wireless networks, consuming more and more data. The number of new wireless devices continues to escalate and the amount of data consumed continues to grow at an exponential rate. In order to address the demand, new wireless technologies are being investigated to evolve the ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.