Week In Review: Manufacturing, Test


Government and trade The U.S. Bureau of Industry and Security (BIS) has expanded its export control regulations for U.S.-based hi-tech companies. The BIS has added more companies to its “Military End User” (MEU) list. The list involves 103 entities, which includes 58 Chinese and 45 Russian companies. The U.S. government has determined that these companies are “military end users” or th... » read more

Week In Review: Manufacturing, Test


Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

Improving EUV Underlayer Coating Defectivity Using Point-Of-Use Filtration


Authors: Aiwen Wu (Entegris, Inc. — United States), Hareen Bayana (Entegris GmbH — Germany), Philippe Foubert (imec — Belgium), Andrea Chacko and Douglas Guererro (Brewer Science, Inc. — United States). This paper describes efforts to leverage different filtration parameters, including retention ratings and membrane materials, to understand their impact on EUV underlayer coating defe... » read more

Semicon West Day Three


It’s day three at Semicon West. (In case you missed it, here’s the day one/two recap of Semicon.) Day three was fairly lively, featuring several keynotes, panels and technical presentations. It’s difficult to write about everything. So I decided to only focus on a few items. Keynote--What happen to automotive? For years, automotive has been a bright spot in the semiconductor i... » read more

Week In Review: Manufacturing, Test


Market research After years of falling demand, the PC market is back. The second quarter of 2020 ended well for the traditional PC market, including desktops, notebooks, and workstations. Global PC shipments jumped 11.2% year-over-year reaching a total of 72.3 million units, according to IDC. As restrictions around the world tightened in the first few weeks of the quarter, demand for notebo... » read more

Blog Review: March 18


Arm's Divya Prasad investigates whether power rails that are buried below the BEOL metal stack and back-side power delivery can help alleviate some of the major physical design challenges facing 3nm nodes and beyond. Rambus' Steven Woo takes a look at a Roofline model for analyzing machine learning applications that illustrates how AI applications perform on Google’s tensor processing unit... » read more

Week In Review: Manufacturing, Test


Chipmakers A fire broke out this week at a joint NAND flash fab between Western Digital (WD) and Kioxia. Kioxia is the former Toshiba NAND flash unit that was recently spun out by the Japanese company. “On Monday, January 6, (morning, January 7 local time) a small fire occurred at one of our joint venture facilities in Yokkaichi, Japan. Local firefighters quickly extinguished the fire, and w... » read more

Week In Review: Manufacturing, Test


Fab tools The confidence level of extreme ultraviolet (EUV) lithography continues to grow as the technology moves into production, but the EUV mask infrastructure remains a mixed picture, according to new surveys released by the eBeam Initiative. D2S has developed new hardware and software that enables a long-awaited technology--full-chip masks using inverse lithography technology (ILT). ... » read more

Outlook For Masks, Materials and Wafers


After a slowdown in the first half of 2019, chipmakers and equipment vendors face a cloudy outlook for the second half of this year, with a possible recovery in 2020. But what about other key technologies like materials, photomasks and silicon wafers? These are also critical for the semiconductor supply chain and are key indicators where the market is heading. In the first half of 2019, m... » read more

Week In Review: Manufacturing, Test


Chipmakers TSMC posted mixed results for the second quarter. It also presented a mixed outlook for the third quarter, according to various reports. TSMC and Samsung are in the midst of a foundry battle at 7nm and 5nm. “TSMC raised its 2019 capex outlook to over $11B, up from prior guidance of $10B-$11B. The increased capex is to support 5nm and 7nm ramps, with accelerated 5G investment a... » read more

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