Manufacturing Bits: Oct. 22


3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

System Bits: Aug. 27


A ring of 18 carbon atoms Scientists at IBM Research – Zurich and Oxford University write about allotropes of carbon – the many versions of atomic carbon formations, such as diamonds and graphite. “Carbon, one of the most abundant elements in the universe, can exist in different forms - called allotropes - giving it completely different properties from color to shape to hardness. For... » read more

Manufacturing Bits: Nov. 27


New kilogram definition After years of debate and scientific work, a group of delegates from 60 countries have voted to redefine four key unit measurements—the kilogram, electric current (ampere), temperature (kelvin), and the amount of substance (mole). The vote took place at the recent 26th General Conference of Weights and Measures. Hosted by the International Bureau of Weights and Mea... » read more