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Manufacturing Bits: Aug. 24


Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Power/Performance Bits: July 6


Configurable photonics Researchers from the University of Southampton developed a configurable/one-time programmable silicon photonic circuit that could reduce production costs by allowing a generic optical circuit to be fabricated in bulk and then later programmed for specific applications such as communications systems, LIDAR circuits or computing applications. Additionally, once programmed,... » read more