tag: FPGAs

The Zen Of Processor Design
By Ed Sperling - 15 Sep, 2016 - Comments: 0

Mark Papermaster, chief technology officer at Advanced Micro Devices, sat down with Semiconductor Engineering to discuss how to keep improving performance per watt, new packaging options, and the increasing focus on customization for specific tasks. What follows are excerpts of that conversation. SE: As we get more into the IoT and we have to deal with more data, not to mention cars where da... » read more

Cars, Security, and HW/SW Co-Design
By Jeff Dorsch - 13 Sep, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss parallel hardware/software design with Johannes Stahl, director of product marketing, prototyping and FPGA, [getentity id="22035" e_name="Synopsys"]; [getperson id="11411" comment="Bill Neifert"], director of models technology, [getentity id="22186" comment="ARM"]; Hemant Kumar, director of ASIC design, Nvidia; and Scott Constable, senior member of ... » read more

Making Drones Secure
By John Edwards - 01 Sep, 2016 - Comments: 0

Critics have accused drones of creating multiple dangers, including invading privacy, colliding with other aircraft, threatening personal safety and even frightening livestock. Yet the biggest drone threat of all may turn out to be attacks made on the vehicles themselves. Drones, also known as UAVs (unmanned aerial vehicles) and UASs (unmanned aerial systems), need a variety of internal ... » read more

It’s Time To Get Your University In Sync With Zynq
By Aldec - 25 Aug, 2016 - Comments: 0

By Zach Nelson It’s time for universities to say goodbye to their outdated FPGA boards and introduce the Xilinx Zynq chip. The chip is a device which combines an FPGA fabric with a processing unit. The chip is very similar to other FPGA devices, but it does have a few key advantages and features that can enhance your designs and increase its capabilities. What can Zynq do? The Zynq ... » read more

Changing Economics In Chip Manufacturing
By Ed Sperling - 18 Aug, 2016 - Comments: 1

The foundry and equipment businesses are poised for significant changes that could affect the balance of power far beyond just the semiconductor manufacturing sector. It’s no secret that the number of companies developing new chips at 7nm is shrinking. There will be even fewer at 5nm. The business case for moving forward is that density must provide a competitive edge. But that density imp... » read more

Prototyping Server Farms
By Tom De Schutter - 26 May, 2016 - Comments: 0

Coming from the virtual prototyping world, I envisioned FPGA-based prototyping as mostly a one on one application, meaning that the system resides with the end user or at least in a room close to the end user. However, it turns out that a lot of companies have moved towards a physical prototyping server farm setup. Let’s look at what it means to have a prototyping server farm, the associat... » read more

ARM Buys Apical
By Jeff Dorsch - 18 May, 2016 - Comments: 0

[getentity id="22186" comment="ARM"] completed its acquisition of [getentity id="22917" comment="Apical Ltd."] for $350 million in cash. Apical provides embedded computer vision and imaging technology, which ARM said has been utilized in more than 1.5 billion smartphones and in about 300 million other consumer and industrial devices, such as digital still cameras, Internet protocol cameras, and... » read more

IP Business Models In Flux
By Ann Mutschler - 12 May, 2016 - Comments: 0

EDA and IP suppliers are engaging with foundries earlier with each manufacturing process node, while those foundries are providing ever more optimized and tuned processes to their customers. As part of this, IP providers must port their IP offerings to the various foundries and processes, putting a squeeze on resources. That raises some difficult questions, such as how to prioritize their li... » read more

Achieve Functional Safety And High Uptime Using TMR
By Synopsys - 11 May, 2016 - Comments: 0

A look at how to build reliable FPGA-based designs, employing triple modular redundancy. To read more, click here. » read more

2.5D Becomes A Reality
By Ed Sperling - 11 May, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

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