The Week In Review: Manufacturing & Design


A new study reveals that a majority of Americans are making some costly miscalculations regarding the performance of their existing PCs. The survey reveals that Americans lack financial savvy when faced with slow computers. Germany’s Merck KGaA, a pharmaceutical, chemical and life science company, announced an agreement with AZ Electronic Materials, under which Merck KGaA would acquire AZ.... » read more

The Week In Review: Manufacturing & Design


Gesture sensing is a hot topic. Apple recently confirmed the acquisition of PrimeSense for a reported $360 million. PrimeSense is an Israel-based company known for its structured light technology. “Gesture sensing of 3D depth without a controller is the standard for game consoles such as Microsoft Kinect for Xbox and new PS Camera for PlayStation 4. Clearly, a future Apple TV is the logical p... » read more

The Week In Review: System-Level Design


Synopsys won a deal with Germany’s Hyperstone, which will use Synopsys verification tools for SoCs in industrial, automotive and medical applications. As SoCs used in industrial and “safety-critical” markets grow in complexity and move to more advanced process nodes, more advanced tools also are necessary. Si2 uncorked a new release of its OpenAccess scripting interface—oaScript Exte... » read more

The Week In Review: Sept. 27


By Ed Sperling Applied Materials shook up the equipment market, announcing a deal to buy Tokyo Electron for about $9.3 billion in stock. The combination of No. 2 Applied and No. 3 TEL in that market equals a new No. 1, surpassing Dutch giant ASML in terms of revenue. Mentor Graphics rolled out a new versiion of its computational fluid dynamics product, adding Monte Carlo radiation modeling... » read more

The Week In Review: Sept. 13


By Ed Sperling Cadence unveiled its next-generation emulation platform, greatly boosting the speed by up to 60x for embedded OS verification and by up to 10x for hardware/software verification. Overall, Cadence says the platform doubles verification productivity with a capacity of up to 2.3 billion gates. Cadence also reported that its mixed-signal LP flow allowed Silicon Labs to cut its MCU p... » read more

The Week In Review: Sept. 6


By Ed Sperling ARM acquired Cadence’s high-resolution display processor cores, which it helped to co-develop. Coupled with ARM’s own graphics, the move sets up ARM to sell complete subsystems. Cadence also won a deal with SMIC, which is using Cadence’s low-power flow and signoff technology for its 40nm process. Mentor Graphics won a deal with Advanced Wireless Semiconductor Co., whic... » read more

The Week In Review: Aug. 23


By Ed Sperling Cadence won a deal with Realtek, which licensed the Tensilica HiFi audio DSP core for voice recognition technology. Fast voice triggers have been possible for some time, but being able to combine that with low power for mobile devices isn’t easy because the devices are always on—or at least enough “on” to pick up voice commands. Mentor Graphics turned in a record-bre... » read more

The Week In Review: Aug. 12


By Mark LaPedus Is the sky falling on semi capital spending? “We have seen several 2014 industry demand estimates in the 20%+ range, based on the ramps of FinFET and 3D NAND,” said Weston Twigg, an analyst with Pacific Crest Securities. “We expect Samsung to ramp spending in Q4, but we believe foundry and logic spending will remain soft for several quarters. As a result, we are developin... » read more

The Week In Review: Aug 5


By Mark LaPedus According to a nationwide online survey conducted by Harris Interactive on behalf of Crucial.com, 36% of those Americans who experienced PC problems in the past six months admit they have lashed out at their slow, underperforming computers by using profanity, screaming and shouting, or by striking it with a fist or other object. Those who experienced computer problems also indi... » read more

The Week In Review: July 22


By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

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