Fan-Outs vs. TSVs

Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Integrated Passives Market Gets Active

Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

The Week In Review: IoT

Finance Trend Micro, the cybersecurity firm, announced a corporate venture fund of $100 million to invest in emerging technology markets, including the Internet of Things. Gartner estimates 26 billion devices will be connected to the Internet by 2020. Products Cisco Jasper introduced the Control Center 7.0 IoT connectivity management platform, with advanced capabilities, premium services, ... » read more