tag: Intel

The Week In Review: IoT
By Jeff Dorsch - 01 Sep, 2017 - Comments: 0

Finance Dublin-based Cubic Telecom has taken in €40 million (about $47.6 million) in Series C funding, bringing its total funding to €75 million (around $89.25 million). Audi Electronics Venture and Qualcomm are existing investors participating in the new round of funding, joined by new investors Ireland Strategic Investment Fund and Valid Soluciones Tecnologicas SAU. Cubic will use the mo... » read more

Blog Review: Aug. 30
By Jesse Allen - 30 Aug, 2017 - Comments: 0

Cadence's Meera Collier explains machine learning, unsupervised algorithms, and why Facebook's recently publicized AI chatbot conversation isn't as inscrutable as it sounds. Synopsys' Robert Vamosi considers recently proposed legislation which seeks to mitigate the risk of botnets commandeering IoT devices used in the U.S. government, including limiting the use of hard-coded passwords and ce... » read more

Tools To Design CNNs
By Ann Mutschler - 28 Aug, 2017 - Comments: 2

Convolutional neural networks are becoming a mainstay in machine learning and artificial intelligence, allowing a network of distributed sensors to collect data and send them to a central brain for processing. This is a relatively simple idea in comparison to today's technology, and the idea of the [getkc id="261" kc_name="convolutional neural network"] has been around for some time. But bui... » read more

What’s New At Hot Chips
By Jeff Dorsch - 25 Aug, 2017 - Comments: 0

By Jeff Dorsch & Ed Sperling Machine learning, artificial intelligence and neuromorphic computing took center stage at Hot Chips 2017 this week, a significant change from years past where the focus was on architectures that addressed improvements in speed and performance for standard compute problems. What is clear, given the focus of presentations, is that the bleeding edge of comput... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Aug, 2017 - Comments: 0

Packaging and test IoT chip startup zGlue recently announced its technology, dubbed the zGlue Integrated Platform (ZiP). In ZiP, chip customers select and configure their designs based on chiplets. Chiplets are proven silicon IP from existing vendors. Then, the technology automatically generates potential implementations of a design. As part of the effort, zGlue has selected Advanced Semicondu... » read more

One Belt, One Road
By Ed Sperling - 24 Aug, 2017 - Comments: 0

China's so-called One Belt, One Road policy on global trade could have significant repercussions on semiconductors and IP if it succeeds. It's hardly a slam-dunk, and China has been vying for a larger position in the semiconductor industry for some time. But this is a completely different strategy because China is not attempting to go it alone this time. China has been rather quietly build... » read more

Portable Stimulus Status Report
By Brian Bailey - 24 Aug, 2017 - Comments: 0

The first release of the Portable Stimulus (PS) standard is slated for early next year. If it lives up to its promise, it could be the first new language and abstraction for verification in two decades. [getentity id="22028" e_name="Accellera"] uncorked the PS Early Adopter release at the Design Automation Conference (DAC) in June. The standard has been more than two years in the making by t... » read more

Blog Review: Aug. 23
By Jesse Allen - 23 Aug, 2017 - Comments: 0

Cadence's Madhavi Rao asks whether India should have more fabs and the role government policy should play. Synopsys' Kapil Rajpal checks out the Serial Peripheral Interface, which is emerging as a popular choice in automotive applications, and various vendor specific flavors. In a video, Mentor's Colin Walls explains inter-task communication and the basic mechanisms of how to pass data fr... » read more

The Week In Review: IoT
By Jeff Dorsch - 18 Aug, 2017 - Comments: 0

Connectivity Longing for LightSquared? The once-bankrupt company that tried to build a network with satellite airwaves and traditional spectrum has been reborn as Ligado Networks, which wants to serve 5G and Industrial Internet of Things applications with a mobile data network, employing satellite communications and other resources. Its founder is Philip Falcone, who was the guiding force behi... » read more

Why Fabs Worry About Tool Parts
By Mark LaPedus - 17 Aug, 2017 - Comments: 2

Achieving high yields with acceptable costs is becoming much more difficult as chipmakers migrate to next-generation 3D NAND and finFET devices—but not just because of rising complexity or lithography issues. To fabricate an advanced logic chip, for example, a wafer moves from one piece of equipment to another in what amounts to 1,000 process steps or more in a fab. Any glitch with the equ... » read more

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