tag: Intel

1-on-1 With Intel’s Foundry Chief
By Mark LaPedus - 17 Jul, 2014 - Comments: 1

By Mark LaPedus & Ed Sperling Semiconductor Engineering sat down to discuss foundry trends, IC scaling, chip-packaging and other topics with Sunit Rikhi, vice president of the Technology and Manufacturing Group at Intel and general manager of Intel’s Custom Foundry unit. SE: Where is Intel at in the foundry business today? Rikhi: We started with a very narrow set of customers. Now, we... » read more

What Happened To 450mm?
By The SE Staff - 17 Jul, 2014 - Comments: 1

By Mark LaPedus, Ed Sperling & Katherine Derbyshire There was a time not very long ago—one process node, in fact—when the economic momentum of Moore’s Law seemed unstoppable with a combination of extreme ultraviolet lithography, larger wafer sizes and a variety of new materials. Shrinking feature sizes is still technically possible, but certainly not with the same promised economic benef... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Jul, 2014 - Comments: 0

As feature sizes continue to shrink and new device architectures are introduced, the IC industry will require new breakthroughs. In fact, feature dimensions will soon have tolerances that are on the order of a few atoms. For the most advanced structures, conventional plasma etch and deposition processes are unable to meet these requirements. As a result, the industry will require tools th... » read more

Confusion Does Not Equal Paralysis
By Ed Sperling - 10 Jul, 2014 - Comments: 0

After attending the two biggest semiconductor conferences in the world, along with a long list of notable conferences targeted to a wide variety of technologies and engineering disciplines, it’s clear the industry is racing ahead. But “ahead” is now a relative term. While Moore’s Law satisfied both economic and technological requirements, it was easy to figure out what “ahead” me... » read more

Server Memory: What Drives Its Growth?
By Loren Shalinsky - 10 Jul, 2014 - Comments: 2

I was recently reading several analyst reports that came out after the end of last quarter, and one caught my eye: "Gartner says Worldwide Server Shipments Grew 1.4%..." It caused me to wonder, how is it possible that server shipments only grow at modest rates, while the DRAM used in those servers is growing at significantly higher rates? Putting my search engine to use, I found a series of ... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

28nm FinFETs?
By Brian Bailey - 10 Jul, 2014 - Comments: 5

One star of the upcoming 14/16nm process node is the introduction of the finFET, a fundamentally new transistor that overcomes many of the limitations associated with planar transistors. While these devices are more complex to construct—and the physical extraction processes associated with them is more complex due to an increased number of resistances and capacitances—they are seen as a tra... » read more

Locking Down The Chip
By Ernest Worthman - 09 Jul, 2014 - Comments: 0

The push toward securing chips is complicated by the amount of third-party IP that is being used inside of today’s complex SoCs. This has cast new light on the potential for on-chip networks to also function in securing signals that flow through those networks. This becomes particularly important with the Internet of Things, because the source of those signals isn’t always obvious to the... » read more

Manufacturing Bits: July 8
By Mark LaPedus - 08 Jul, 2014 - Comments: 1

Intel foundry deal At the Semicon West trade show in San Francisco, Intel announced that it has entered into a foundry agreement with Panasonic’s LSI Business Division. Intel's custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel's 14nm low-power manufacturing process. Intel’s low-power process will be a derivative of its general-purpose 14nm proc... » read more

Accellera Updates UVM Standard
By Ed Sperling - 01 Jul, 2014 - Comments: 2

Accellera uncorked its backward-compatible UVM 1.2 standard, which fixes dozens of bugs, including sequences for run-time phasing and support for multithreading. “We’ve solved more than a dozen incompatibilities and improved overall productivity,” said Intel’s Thomas Alsop, who serves as co-chair of the UVM (Universal Verification Methodology) working group. “This is a major releas... » read more

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