tag: Intel

Manufacturing Bits: July 1
By Mark LaPedus - 01 Jul, 2014 - Comments: 0

Nanotubes in 4D The California Institute of Technology (Caltech) has continued to advance its efforts in four-dimensional electron microscopy. In 4D microscopy, electrons bombard a sample. Each electron scatters off the sample. This produces an image at just a femtosecond in duration. Then, millions of the images are stitched together, which, in turn, produces a digital movie in 4D. [cap... » read more

The Week In Review: Design
By Ed Sperling - 27 Jun, 2014 - Comments: 0

Tools eSilicon uncorked a GDSII online quote system for TSMC, which allows chipmakers to pick a variety of information ranging from process technology to package to yield and tapeout and production forecast and get a quote within minutes. This is a new twist in the value chain provider market. Synopsys added program to speed up FPGA-based prototype creation, which includes approved third-pa... » read more

Game Of Eco Systems
By Frank Schirrmeister - 26 Jun, 2014 - Comments: 0

My first ever blog post on May 28, 2008, was called “May you live in interesting times …”, starting with “the view from the top” at Synopsys. At the time, my focus was abstraction levels and how the industry has been moving upwards for decades. While it is not a Chinese proverb after all (read my blog above), we still do live in interesting times, perhaps more so that ever. One of the... » read more

Will 7nm And 5nm Really Happen?
By Mark LaPedus - 19 Jun, 2014 - Comments: 11

As leading-edge chipmakers continue to ramp up their 28nm and 20nm devices, vendors are also updating their future technology roadmaps. In fact, IC makers are talking about their new shipment schedules for 10nm. And GlobalFoundries, Intel, Samsung and TSMC are narrowing down the options for 7nm, 5nm and beyond. There is a high probability that IC makers can scale to 10nm, but vendors face a ... » read more

Has The IC Industry Hit A ‘Red Brick Wall’?
By Mark LaPedus - 19 Jun, 2014 - Comments: 2

In the mid-1980s, the semiconductor industry was in a crisis. Chipmakers were looking for ways to break the magical one-micron barrier. Many thought X-ray lithography would be required to break the barrier, but as it turned out, traditional optical technology did the trick. And the industry marched on. Then, in 2000 or so, the IC industry was nearing the so-called “red brick wall,” which... » read more

Blog Review: June 18
By Ed Sperling - 18 Jun, 2014 - Comments: 1

Mentor’s Vern Wnek recalls “a living hell” of being trapped in a small office for three weeks with a PCB designer who ate too much garlic and sweated profusely. This could be a reality TV series. What do engineers really think about UVM? Cadence's Richard Goering braved a 7 a.m. breakfast at DAC to hear a panel of experts, including reps from Intel, Ericsson, Imagination and Freescale,... » read more

The Power Of eDRAM
By Barry Pangrle - 16 Jun, 2014 - Comments: 1

In last month’s article we looked at different aspects of technology nodes and the multiple techniques that are used to keep scaling on its path of increasing density. From an energy standpoint, it’s expensive to move data around and with the high bandwidth that’s needed to keep processors “fed,” engineers are looking at ways to keep data closer to the processing logic and minimize th... » read more

The Week In Review: Design
By Ed Sperling - 13 Jun, 2014 - Comments: 0

Tools Mentor Graphics uncorked a tool for IC, package and board optimization, assembly and visualization. Of particular note is a “virtual die model” capability, which can be used across multiple domains in the design process. Deals Rambus inked a patent licensing agreement with Qualcomm Global Trading, a subsidiary of Qualcomm, for memory, interface and security technologies. The secu... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Jun, 2014 - Comments: 0

In a much-anticipated deal, IBM is close to selling its chip unit to GlobalFoundries, according to Bloomberg. GlobalFoundries wants IBM’s engineers and the IP, and not the fabs. Intel lost its challenge against a record 1.06 billion euro ($1.44 billion) European Union fine handed down five years ago, according to Reuters. The EU said Intel tried to thwart AMD by giving rebates to PC makers... » read more

Manufacturing Bits: June 10
By Ed Sperling - 10 Jun, 2014 - Comments: 2

Self-Assembling Nano Films Applying thin films with uniformity has always been an engineering challenge, but as feature sizes shrink the problem become even more pronounced. But a new approach developed by Lawrence Berkeley National Labs’ Materials Science Division could end up simplifying this process. The new approach used chloroform as an annealing solvent to create self-assembling arr... » read more

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