tag: Intel

The Week In Review: Design
By Ed Sperling - 06 Jun, 2014 - Comments: 0

Tools Mentor Graphics rolled out embedded Linux software for AMD’s x86 G-series SoCs, code-named Steppe Eagle and its Crowned Eagle CPUs. Ansys-Apache and TowerJazz have created a power noise and reliability signoff design kit, including reference flow guidelines, test case examples and flow setup guidance. Synopsys updated its verification portfolio with static and formal tools for CD... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 May, 2014 - Comments: 0

GlobalFoundries’ campus in upstate New York employs over 2,200 workers. It is looking to add 600-800 more people by the end of 2014. The company is seeking out engineers with four-year degrees and technicians with associates degrees. It is also bringing in engineers from IBM to ramp its fab in New York. Applied Materials introduced the Endura Ventura PVD system that helps reduce the cost o... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 May, 2014 - Comments: 1

About 150 to 200 employees from IBM’s chip unit will be dispatched to work at GlobalFoundries, according to the Poughkeepsie Journal. GlobalFoundries said the arrangement is temporary, according to the report. GlobalFoundries is the leading candidate to buy IBM’s chip unit, which is apparently on the block. To date, however, GlobalFoundries and IBM have yet to make any announcements on the... » read more

SEMICON West Preview
By SEMI - 19 May, 2014 - Comments: 0

By Paula Doe The fast growing demand for bandwidth is driving telecomm and data center user interest in moving high speed optical connections closer and closer to the chips, as recent advances in packaging technology, from microbumping to bonding to wafer-level redistribution now help make it possible. Chip-to-chip and chip-to-board optical connections increasingly look like a viable soluti... » read more

Shootout At 28nm
By Ed Sperling - 15 May, 2014 - Comments: 0

By Ed Sperling & Mark LaPedus Samsung, Soitec and STMicroelectronics are joining forces on 28nm FD-SOI, creating a showdown with TSMC and others over the best single-patterned processes and materials and raising questions about how quickly companies need to move to the finFET technology generation. The multi-source manufacturing collaboration agreement for fully depleted silicon-on-insulato... » read more

Is 450mm Dead In The Water?
By Mark LaPedus - 15 May, 2014 - Comments: 3

At one time, Intel, TSMC and Samsung were aggressively beating the 450mm drum. Chipmakers wanted, if not demanded, 450mm pilot line fabs by 2016, with high-volume manufacturing 450mm plants slated by 2018. At least for those companies, 450mm made some sense. Moving to 450mm wafers would supposedly give chipmakers a 2.25x boost in wafer area and a 30% cost reduction over 300mm substrates. But... » read more

The Bumpy Road To FinFETs
By Mark LaPedus - 15 May, 2014 - Comments: 2

The shift from planar transistors to finFETs is a major inflection point in the IC industry. FinFETs are expected to enable higher performance chips at lower voltages. And the next-generation transistor technology also could allow the industry to extend CMOS to the 10nm node and perhaps beyond. But as it turns out, finFET technology is also harder to master than previously thought. For exam... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 May, 2014 - Comments: 0

Samsung Electronics announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips, dubbed 3D V-NAND. A recent chemical leak at Intel’s fab in Arizona was contained and two workers were taken to a hospital for observation, according to reports. Apparently, Intel was i... » read more

FinFET Learning
By Ed Sperling - 08 May, 2014 - Comments: 0

FinFETs are not simple to work with. They’re difficult to manufacture, tricky to design, and they run the risk of greatly increased dynamic power density—particularly at 14/16nm, where extra margin is hard to justify—which affects everything from electromigration to signal integrity. Moreover, while finFETs have been on the drawing board for more than a decade, it’s taken four years ... » read more

Pointing Fingers, Often In The Wrong Direction
By Ed Sperling - 08 May, 2014 - Comments: 0

Every design these days, regardless of whether it’s a processor, an SoC, an ASIC, FPGA or stacked die, relies on a combination of re-used and third-party intellectual property. No company—not even Intel, Apple or Samsung—has the capability of building everything itself within a highly compressed market window. There is a spectrum of IP use and re-use, of course. In some cases, it may i... » read more

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