tag: Intel

The Week In Review: Manufacturing
By Mark LaPedus - 02 May, 2014 - Comments: 0

Intel has submitted a business plan to upgrade its fab in Israel, according to reports. Crocus Nano Electronics (CNE), the joint venture founded in 2011 by Crocus Technology and Russia’s RUSNANO, has raised $60 million from its investors. The venture is Russia’s first 300mm fab. This first production line was completed one year after construction began. Currently, 200mm and 300mm CMOS wa... » read more

Securing Chip Data More Critical Than Ever
By Ann Mutschler - 01 May, 2014 - Comments: 0

Everywhere you turn in the mainstream media, it is easy to find stories of security breaches – from Target not adequately protecting customer data to cars allegedly being hacked to hackers themselves showing how easy it is to do what they do. As technology increases in complexity, so do the hackers themselves. This is a problem. As such, chipmakers are increasingly becoming aware of vulner... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Apr, 2014 - Comments: 0

Worldwide semiconductor capital equipment spending is projected to total $37.5 billion in 2014, an increase of 12.2% from 2013 spending of $33.5 billion, according to Gartner. Capital spending will increase 5.5% in 2014 as the industry begins to recover from the recent economic downturn. The 3D NAND market will take longer to develop. Samsung has shipped a 3D NAND device. Micron and SK Hynix... » read more

SoC Assembly And IP Reuse
By Kurt Shuler - 24 Apr, 2014 - Comments: 2

I had the honor and opportunity to present at the 2014 Electronic Design Process Symposium in Monterey last Friday. This annual workshop is run by the IEEE Computer Society of Silicon Valley and the IEEE Council on Electronic Design Automation. There were more than 30 participants each day. Most of them very experienced people with lots of technical and business responsibilities. It was ... » read more

How To Shorten Hardware-Software Development Cycles
By Frank Schirrmeister - 24 Apr, 2014 - Comments: 0

Doing more hardware-software development prior to silicon promises significant productivity and time-to-market improvements. Part of this is shifting software development “to the left,” which can compress development Last month, I blogged about “The Great Shift to the Left,” and I pointed out some of the organizational challenges associated with compressing the development cycle usin... » read more

Blog Review: April 23
By Ed Sperling - 23 Apr, 2014 - Comments: 0

Mentor’s John Day looks backward through a smart rearview mirror from Nissan. No glare, even at night or at sunset, and a wider field of vision. You have to wonder why this technology took so long. Synopsys’ Karen Bartleson wonders when the IoT will actually arrive, given the delay in durable goods, a concern over security and the effects of government regulation. Answer: When we stop ta... » read more

The Week In Review: Design
By Ed Sperling - 18 Apr, 2014 - Comments: 0

Certifications TSMC certified Mentor Graphics’ DFM, place and route and custom IC tools, as well as its SPICE simulator, for the 16nm finFET process.  The foundry also certified Cadence’s digital and custom/analog tools for that process, including physical verification, QRC extraction, timing sign off and its power integrity solution. And it certified Synopsys’ digital and custom soluti... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Apr, 2014 - Comments: 0

There is more evidence of a fab tool slowdown. In fact, ASML itself sounded the alarm during its earnings conference call this week. “ASML noted uncertainty regarding the timing of both the 16/14 nm finFET ramp at foundries (the company is seeing a delay from customers as the technology is still in development, in our view) and 3D NAND,” said Weston Twigg, an analyst from Pacific Crest Secu... » read more

What If EUV Fails?
By Mark LaPedus - 17 Apr, 2014 - Comments: 2

It’s the worst kept secret in the industry, but extreme ultraviolet (EUV) lithography will likely miss the 10nm node. So, chipmakers will likely extend and use today’s 193nm immersion lithography down to 10nm. This, of course, will require a complex and expensive multiple patterning scheme. Now, chipmakers are formulating their lithography strategies for 7nm and beyond. As it stands now,... » read more

Billions And Billions Invested
By Mark LaPedus - 17 Apr, 2014 - Comments: 4

Over the years, next-generation [getkc id="80" kc_name="lithography"] (NGL) has suffered various setbacks and delays. But until recently, the industry basically shrugged its shoulders and expressed relatively little anxiety about the NGL delays. After all, optical lithography was doing the job in the fab and NGL would eventually materialize. Today, however, the mood is different. In fact, th... » read more

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