Moving AI Workloads To The Edge


Experts At The Table: Semiconductor Engineering gathered a group of experts to discuss how some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. The panel included Frank Ferro, group director in the Silicon Solutions Group at Cadence; Eduardo Montanez, vice president an... » read more

Race to 448 Gbps


The relentless growth in data center and AI workloads is accelerating the need for faster, more efficient interconnect technologies. As applications like large language models and distributed training infrastructures push the limits of bandwidth, 400/800G Ethernet is quickly becoming a bottleneck. To support next-generation performance at 1.6T and 3.2T system levels, engineers must enable relia... » read more

Blog Review: Nov. 5


Synopsys' Igor Markov points out how numerical simulation tools advance quantum computing R&D by capturing both quantum-mechanical behavior and classical electromagnetic effects so researchers can evaluate design alternatives before fabrication and gain insight into how devices operate under realistic conditions. Siemens' Stephen V. Chavez finds that impedance modeling and control are mi... » read more

Chip Industry Week in Review


San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Thermal, Mechanical, And Material Stresses Grow With Die Stacking


Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause problems at any point during its expected lifetime. This includes everything from workload-dependent thermal gradients to mechanical and electrical stress, which may become more pronounced over time wi... » read more

Even With AI Inroads, Human Chip Designers Still Essential


The proliferation of AI tools seems perfectly matched to fill a talent shortage, but a closer look shows the skills do not entirely overlap. Certain parts of the EDA pipeline require human engineers, and it seems likely to stay that way for the foreseeable future. The dark art of analog design, the final word on safety-critical functional safety, high-level architectural decisions, product i... » read more

Blog Review: Oct. 29


Siemens' Ujjwal Negi and Prashant Dixit warn that while UCIe 3.0 improves performance and efficiency through higher data rates, runtime recalibration, priority sideband messaging, low-power sideband operation, and circular buffer transport, those enhancements also increase verification complexity. Cadence's Anika Sunda suggests that a unified digital thread that connects verification environ... » read more

Blog Review: Oct. 22


Cadence's Sandip Sadadiya shows what's new in the AMBA AXI Issue L protocol update, which introduces a new credit-based transport mechanism that replaces the traditional VALID/READY handshake, along with improved flow control mechanisms. Siemens' Farhad Ahmed highlights the growing need to do clock domain crossing (CDC) and reset domain crossing (RDC) analysis in a hierarchical way and intro... » read more

Chip Industry Week in Review


The Open Compute Project (OCP) Summit kicked off this week in San Jose, dominated by open standards, massive scaling of AI infrastructure, chiplet architectures, and energy-efficiency. Among the highlights: An initiative to standardize data center infrastructure and advance Ethernet for AI. New contributions to OCP's Open Chiplet Economy ecosystem, including Arm's new Foundation Chiplet... » read more

Startup Tips To Get From Seed Funding To Series A, B, C


Startups are often created by experienced engineers who figure out how to solve a technical problem they are dealing with at work, or by PhD candidates in research labs before they have even started their first full-time job. Either way, getting seed money to the tune of a few million dollars is relatively easy compared to securing further rounds of funding and achieving the company’s exit go... » read more

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