Chip Industry Technical Paper Roundup: Feb. 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=521 /] Find more semiconductor research papers here. » read more

Thermal Characterization For Power Semiconductor Packages (KATECH)


Researchers from Korea Automotive Technology Institute published "Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance Modeling." Abstract "Junction-to-case thermal resistance (RthJC ) is a critical parameter for assessing the reliability and thermal performance of power semiconductor devices. Conventional JEDEC-ba... » read more