Chip Industry Technical Paper Roundup: Oct. 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=482 /] Find more semiconductor research papers here. » read more

Framework for Optimizing Reliability and Thermal Management of 3DICs (National Taiwan Univ., Lamar Univ.)


A new technical paper titled "The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits" was published by researchers at National Taiwan University and Lamar University. Abstract "The use of vertically stacked architectures in three-dimensional integrated circuits (3DICs) offers a transformative path for advancing Moore’s Law by significantly boosting co... » read more