Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Technical Paper Roundup: Aug. 30


New technical papers added to Semiconductor Engineering’s library this week. [table id=47 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Max Planck Generates Up To 14 Entangled Photons In A Defined Way And With High Efficiency


A new technical paper titled "Efficient generation of entangled multiphoton graph states from a single atom" was published by researchers at Max Planck Institute of Quantum Optics. The team of physicists "generated up to 14 entangled photons in an optical resonator, which can be prepared into specific quantum physical states in a targeted and very efficient manner. The new method could facil... » read more