tag: Mentor

Securing Connected And Autonomous Vehicles
By Andy Gothard - 02 Dec, 2021 - Comments: 0

Vehicles are on track to become highly sophisticated Internet of Things (IoT) devices. With the added functionality that connects vehicles to other vehicles, the infrastructure, and even pedestrians, the opportunity for hacking expands. Challenges like complexity and the burden of legacy systems further complicate the situation. The future of connected and autonomous vehicles (CAV) demands leve... » read more

Why It’s So Difficult — And Costly — To Secure Chips
By Ed Sperling - 02 Dec, 2021 - Comments: 0

Rising concerns about the security of chips used in everything from cars to data centers are driving up the cost and complexity of electronic systems in a variety of ways, some obvious and others less so. Until very recently, semiconductor security was viewed more as a theoretical threat than a real one. Governments certainly worried about adversaries taking control of secure systems through... » read more

Advanced Packaging For Automotive Chips
By Ann Mutschler - 02 Dec, 2021 - Comments: 0

Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Effectively Addressing The Challenge Of Securing Connected And Autonomous Vehicles
By Siemens EDA - 01 Dec, 2021 - Comments: 0

Vehicles are becoming the most sophisticated connected objects in the ‘Internet of Things’. As vehicles integrate functionality that will enable a fully autonomous future, the attack surface grows substantially. Combined with remote connectivity at multiple points, the clock is ticking in a race to improve cybersecurity in all types of vehicles to ensure that all stakeholders, but particula... » read more

Blog Review: Dec. 1
By Jesse Allen - 01 Dec, 2021 - Comments: 0

Synopsys' Mike Gianfagna points to three events that created a fundamental shift in product development that has enabled rapid introduction of a wide range of new products. Siemens' Sagi Reuven considers some key challenges facing the supply chain and the impact on electronics manufacturers, from rising shipping costs to shortages of raw materials and transportation labor. Cadence's Frank... » read more

Missing Interposer Abstractions And Standards
By Brian Bailey - 29 Nov, 2021 - Comments: 0

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, it will be a technique that only large companies can deploy because they need to treat everything almost as if it were a single die. The construction of large systems uses techniques, such as ab... » read more

Blog Review: Nov. 24
By Jesse Allen - 24 Nov, 2021 - Comments: 0

Cadence's Paul McLellan introduces the theory and practice of datapath formal verification and explores two use cases of dot-product accumulate systolic design and hashing design. Siemens EDA's Rich Edelman shows that constructing an in-order UVM scoreboard doesn't have to be a difficult or complex task, and certainly simpler than replacing a laptop's keyboard. Synopsys' Gordon Cooper con... » read more

Product Lifecycle Management For Semiconductors
By Brian Bailey - 23 Nov, 2021 - Comments: 1

Product lifecycle management (PLM) and the semiconductor industry have always been separate, but pressure is growing to integrate them. Automotive, IIoT, medical, and other industries see that as the only way to manage many aspects of their business, and as it stands, semiconductors are a large black box in that methodology. The technology space is driven by a mix of top down and bottom-up p... » read more

Advanced Packaging Shifts Design Focus To System Level
By Ann Mutschler - 23 Nov, 2021 - Comments: 0

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it's also straining some EDA tools and methodologies and creating gaps in areas where none existed. These changes are causing churn in unexpected areas. For some chip companies, this has resulted in a slowdown in hiring of ASIC designers and an uptick in new jo... » read more

Gaps In The AI Debug Process
By Brian Bailey - 23 Nov, 2021 - Comments: 0

When an AI algorithm is deployed in the field and gives an unexpected result, it's often not clear whether that result is correct. So what happened? Was it wrong? And if so, what caused the error? These are often not simple questions to answer. Moreover, as with all verification problems, the only way to get to the root cause is to break the problem down into manageable pieces. The semico... » read more

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