Heterogenous Integration Creating New IP Opportunities


The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

Using AI To Speed Up Edge Computing


AI is being designed into a growing number of chips and systems at the edge, where it is being used to speed up the processing of massive amounts of data, and to reduce power by partitioning and prioritization. That, in turn, allows systems to act upon that data more rapidly. Processing data at the edge rather than in the cloud provides a number of well-documented benefits. Because the physi... » read more

MIPI In Next Generation Of AI IoT Devices At The Edge


The history of data processing begins in the 1960’s with centralized on-site mainframes that later evolved into distributed client servers. In the beginning of this century, centralized cloud computing became attractive and began to gain momentum becoming one of the most popular computing tools today. In recent years however, we have seen an increase in the demand for processing... » read more

Blog Review: July 13


Siemens' John Sturtevant finds that the patterning requirements of next generation lithographic processes have pushed lithographers to explore the advantages of curvilinear masks, and notes some of the tools coming along to help. Cadence's Paul McLellan learns from Kyle Chen of Microsoft and Suomin Cui of Cadence how deep learning and electromagnetic solvers can be used to optimize high-dens... » read more

IP Industry Transformation


The design IP industry is developing an assortment of new options and licensing schemes that could affect everything from how semiconductor companies collaborate to how ICs are designed, packaged, and brought to market. The IP market already has witnessed a sweeping shift from a "design once, use everywhere" approach, to an "architect once, customize everywhere" model, in which IP is highly ... » read more

Week In Review: Design, Low Power


Arm unveiled the Arm Cortex-M85 processor and expanded Arm Virtual Hardware to more platforms, including 3rd party devices. The Cortex-M85 is the highest performance Cortex-M processor to date, with 30% scalar performance uplift compared to the Cortex-M7, technology to support endpoint ML and DSP workloads, and includes Pointer Authentication and Branch Target Identification (PACBTI), a new arc... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility DENSO Corporation and UMC’s Japanese subsidiary United Semiconductor Japan Co., Ltd. (USJC) are collaborating on power semiconductors production for the automotive market at USJC’s 300mm fab. USJC will install an insulated gate bipolar transistor (IGBT) line at its wafer fab. Renesas Electronics uncorked an integrated automotive ECU Virtualization Platform for devel... » read more

Week In Review: Design, Low Power


Tools & IP Ansys updated its product suite, adding new tools and workflows in Ansys 2022 R1. It adds Phi Plus meshing technology to improve simulation of PCB and complex 3D IC packaging. It also introduces RedHawk-SC SigmaDVD, a statistically realistic modeling technique to identify the worst-case dynamic voltage-drop in hours and make it possible to achieve near 100% coverage of all relev... » read more

MIPI Standards Gaining Traction In New Markets


An explosion of low-cost, high-performance image sensors for a growing number of applications is propelling the MIPI interface into a variety of new markets, where standardized signal protocols and characteristics are becoming essential. For years, MIPI has been almost synonymous with mobile phones. But as higher-resolution image sensors increasingly are deployed in automotive, AI, IoT, and ... » read more

Innovations In Sensor Technology


Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

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