EDA On Board With New Package Options


A groundswell of activity around multi-die integration and advanced packaging is pushing EDA companies to develop integration strategies that speed up time to sign-off, increase confidence that a design will work as expected, while still leaving enough room for highly customized solutions. Challenges range from how to architect a design, how to explore the best options and configurations, ho... » read more

CXL Vs. CCIX


Kurt Shuler, vice president of marketing at ArterisIP, explains how these two standards differ, which one works best where, and what each was designed for. » read more

Meltdown, Spectre And Foreshadow


Ben Levine, senior director of product management for Rambus’ Security Division, talks with Semiconductor Engineering about hardware-specific attacks, why they are so dangerous, and how they work. » read more