Chip Industry Technical Paper Roundup: Feb. 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=523 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Optimal Surface Condition For Improved Cu-to-Cu Direct Bonding (NCHU, Osaka Univ.)


A new technical paper titled "Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding" was published by researchers at National Chung Hsing University (NCHU) and Osaka University. Abstract excerpt "Three-dimensional integrated circuits (3D IC) require low-temperature, high-reliability Cu–Cu direct bonding to support fine-pitch vertical interconnects and heterogeneous... » read more

Chip Industry Week in Review


Microsoft, OpenAI, and NVIDIA warned about power swings and physical damage to power grids increasing from AI training workloads and jointly proposed a multi-pronged approach to stabilize power in AI training data centers. Meanwhile, Anthropic issued a warning about the weaponization of agentic AI in a new 25-page Threat Intelligence report. Key concerns involve the evolution in AI-assisted ... » read more