Chip Industry Technical Paper Roundup: Feb. 16

AFMTJs for IMC; test generation w/high functional switching activities; Cu-to-Cu bonding; high-clockrate free-space IMC; information flow verification; YOLO advances; ultrafast visual perception beyond human capabilities; 3D printing of nanomaterials-based electronics.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
AFMTJs for In-Memory Computing: Modeling and Case Study University of Arizona
Test Generation for Subcircuits with High Functional Switching Activities Purdue University
High-clockrate free-space optical in-memory computing UC Berkeley, USC, and TU Berlin
Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding National Chung Hsing University and Osaka University
IFV: Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology University of Florida
Advances in You Only Look Once (YOLO) algorithms for lane and object detection in autonomous vehicles RMIT et al.
Ultrafast visual perception beyond human capabilities enabled by motion analysis using synaptic transistors Beihang University, BIT, KAUST, Cambridge et al.
Three-dimensional printing of nanomaterials-based electronics with a metamaterial-inspired near-field electromagnetic structure Rice University, University of Utah, NUS

Find more semiconductor research papers here.



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