New technical papers recently added to Semiconductor Engineering’s library:
Technical Paper
Research Organizations
Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design 🔗
Univ. of Edinburgh, Peking Univ., Cambridge, CAS, HKUST
In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Direct...
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