tag: Onto

Full Metrology Solutions For Advanced RF With Picosecond Ultrasonic Metrology
By Onto Innovation - 11 Jan, 2021 - Comments: 0

Picosecond Ultrasonics (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-contact, non-destructive technology and its capabilities for simultaneous multiple layer measurement. Measuring velocity and thickness simultaneously for transparent and semi-transparent films offers a lot of potential for not only monitoring ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Jan, 2021 - Comments: 0

Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 08 Jan, 2021 - Comments: 0

Automotive/Mobility Autonomous car company Waymo is making a point of not calling itself a self-driving car company because the company said in a blog to do so would be a dangerously misleading. Waymo says it will instead call its technology ‘fully autonomous driving technology.’ “Unfortunately, we see that some automakers use the term ‘self-driving’ in an inaccurate way, giving cons... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Dec, 2020 - Comments: 0

Chipmakers SMIC’s shares fell following the resignation of the company co-CEO, according to a report from Bloomberg. Liang Mong Song, co-CEO of the Chinese foundry company, has proposed to resign and the company has become aware of Liang’s intention of conditional resignation, according to a filing. A former technologist at TSMC and Samsung, Liang has opposed the appointment of a new board... » read more

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP
By Onto Innovation - 07 Dec, 2020 - Comments: 0

Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, mobile and AI will all use this technology. According to Yole Développement’s analysis, the fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014,... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Nov, 2020 - Comments: 0

Market research VLSI Research has raised its forecast for semiconductors and fab equipment in 2020. In its previous forecast, VLSI Research projected that the equipment market would reach $84.8 billion in 2020, up 10.1% over 2019. Now, in its latest forecast (See page 2), the equipment market is projected to hit $89.8 billion in 2020, up 16.6%. “The equipment business is booming,” said ... » read more

Defect Challenges Grow For IC Packaging
By Mark LaPedus - 22 Oct, 2020 - Comments: 0

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these technologies are necessary, they also are complementary. No one tool can meet all defect inspection requirements. As a result, packaging vendors may need to buy more and different tools. For years, p... » read more

Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy