Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Week in Review


Samsung and SK hynix joined OpenAI's Stargate initiative to ensure there will be enough memory chips to meet the needs of AI data centers. The goal is to produce up to 900,000 DRAM wafer starts per month. OpenAI also inked agreements to explore the development of next-gen data centers in Korea. Axcelis Technologies (ion implantation systems) will merge with Veeco Instruments (compound semic... » read more

Chip Industry Week In Review


U.S. Trade Representative Jamieson Greer warned Southeast Asian semiconductor manufacturers that they must shift production to the U.S. or face new punitive tariffs, reports the South China Morning Post. President Trump previously floated a 100% tariff on imported chips. Malaysia and other regional economies are offering large concessions and promises of U.S. goods purchases in hopes of securin... » read more

Chip Industry Week in Review


The U.S. is considering annual approvals for Samsung and SK hynix to export chipmaking tools and materials to their factories in China, replacing perpetual waivers granted under the validated end user system, reports Bloomberg. The proposal, presented by the U.S. Commerce Department to South Korean officials, would require the companies to reapply each year for specific quantities of restricted... » read more

What Do LLMs Want from Hardware


Figure 1: Noam Shazeer, Google Gemini vice president, presented this in his Hot Chips 2025 talk. Noam Shazeer is Google’s vice president of engineering for Gemini, their LLM competitor to ChatGPT. He talked recently at Hot Chips: “Predictions for the Next Phase of AI." He has worked on LLMs for a decade since inventing the transformer model in 2017. As his slide says, LLMs can take adv... » read more

Chip Industry Technical Paper Roundup: Sept 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=469 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


Microsoft, OpenAI, and NVIDIA warned about power swings and physical damage to power grids increasing from AI training workloads and jointly proposed a multi-pronged approach to stabilize power in AI training data centers. Meanwhile, Anthropic issued a warning about the weaponization of agentic AI in a new 25-page Threat Intelligence report. Key concerns involve the evolution in AI-assisted ... » read more

Power Stabilization To Allow Continued Scaling Of AI Training Workloads (Microsoft, OpenAI, NVIDIA)


A new technical paper titled "Power Stabilization for AI Training Datacenters" was published by researchers at Microsoft, OpenAI, and NVIDIA. Abstract "Large Artificial Intelligence (AI) training workloads spanning several tens of thousands of GPUs present unique power management challenges. These arise due to the high variability in power consumption during the training. Given the synchron... » read more

Chip Industry Technical Paper Roundup: August 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=467 /] Find more semiconductor research papers here. » read more

Overview: Ultra Ethernet’s Design and Architectural Advancements (ETH Zurich, Broadcom, HPE et al.)


A new technical paper titled "Ultra Ethernet's Design Principles and Architectural Innovations" was published by researchers at ETH Zurich, Broadcom, Hewlett Packard Enterprise, OpenAI, Intel, Microsoft, AMD and Cisco. Abstract "The recently released Ultra Ethernet (UE) 1.0 specification defines a transformative High-Performance Ethernet standard for future Artificial Intelligence (AI) and ... » read more

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