Chip Industry Technical Paper Roundup: Sept 2

HW weaknesses report; power stabilization at AI training data centers; electrochemical methods for nanoscale devices; LLM-based chiplet design generation; dynamic KV cache scheduling in heterogeneous memory; vertical FETs; vector-symbolic computing; AI agents for photonic IC design automation.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Power Stabilization for AI Training Datacenters Microsoft, OpenAI, NVIDIA
2025 Most Important Hardware Weaknesses Hardware CWE Special Interest Group
Vertical FET Optimization at Angstrom Nodes: A Comparative Study With Horizontal FET POSTECH, Georgia Tech
MAHL: Multi-Agent LLM-Guided Hierarchical Chiplet Design with Adaptive Debugging University of Minnesota – Twin Cities
AI Agents for Photonic Integrated Circuit Design Automation University of Toronto, Max Planck, GDSFactory, MIT, Axiomatic_AI Inc.
Accelerating LLM Inference via Dynamic KV Cache Placement in Heterogeneous Memory System Rensselaer Polytechnic Institute, IBM
Exploring Electrochemical Methods for Precision Stress Control in Nanoscale Devices University of Bristol
Cross-Layer Design of Vector-Symbolic Computing: Bridging Cognition and Brain-Inspired Hardware Acceleration Purdue University, Georgia Institute of Technology

Find more semiconductor research papers here.



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